Chemical Bond Engineering Toward Extraordinary Power Factor and Service Stability in Thermoelectric Copper Selenide

Haihua Hu,Bin Su,Xiaodong Liu,Hao-Cheng Thong,Yilin Jiang,Hezhang Li,Jing-Wei Li,Hua-Lu Zhuang,Zhanran Han,Jincheng Yu,B. Layla Mehdi,Jing-Feng Li
DOI: https://doi.org/10.1016/j.joule.2023.12.019
IF: 46.048
2024-01-01
Joule
Abstract:Porous structures can hinder phonon transport but inevitably deteriorate electrical and mechanical properties. In order to suppress the formation of pores, we propose a chemical bond engineering strategy to constrain the volatile Se in Cu2Se-based materials via applicable elemental substitution. Benefiting from the reduced porosity and successful dual doping, Cu vacancies and carrier mobility are optimized for the Gd2S3-added Cu1.99Se samples, leading to an ultrahigh power factor of X17.4 mW cm -1 K-2 at 1,000 K and a high figure of merit of X2.5 at 1,050 K. The fabricated segmented single -leg device maintains a high conversion efficiency of -9.0% and a power density of 636.3 mW cm -2 at DT = 516 K without obvious degradation over 110 cycles of stability tests. Our work demonstrates a paradigm to control the porosity caused by elemental volatilization, providing more opportunities to enhance both the thermoelectric performance and service stability.
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