Systematic Microwave Network Analysis for 3D Integrated Systems

Er‐Ping Li

DOI: https://doi.org/10.1002/9781118166727.ch5

2012-01-01

Abstract:This chapter contains sections titled: Intrinsic Via Circuit Model for Multiple Vias in an Irregular Plate Pair Parallel Plane Pair Model Cascaded Multiport Network Analysis of Multilayer Structure with Multiple Vias References

What problem does this paper attempt to address?

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

Yao-Jiang Zhang,Zaw,Xing-Chang Wei,En-Xiao Liu,Jun Fan,Er-Ping Li

DOI: https://doi.org/10.1109/temc.2010.2040389

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:An efficient microwave network method is proposed for signal and power integrity analysis of a multilayer printed circuit board with multiple vias and decoupling capacitors. The multilayer parallel plate structure is described as a cascaded microwave network. The admittance matrix of a single plate pair with ports defined in via holes both on top and bottom plates is obtained through the intrinsic via circuit model and impedance matrix between two plates. A recursive algorithm is provided to obtain the combined admittance matrix of two layers of plate pair coupled through via holes on a common plate. Decoupling capacitors are naturally treated as impedance loads to the cascaded admittance network. Numerical simulations and measurements have been used to validate the method and good agreements have been observed. While the method is as accurate as full-wave numerical solvers, it achieves much higher efficiencies both in CPU time and memory requirements.
Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Zaw Zaw Oo,Enxiao Liu,Xingchang Wei,Yaojiang Zhang,Erping Li

DOI: https://doi.org/10.1109/TCPMT.2011.2143712

2011-01-01

Abstract:In this paper, an efficient cascaded microwave network approach is presented for power and signal integrity analysis of multilayer printed-circuit boards (PCBs) and advanced electronic packages with multiple signal traces, multiple power-ground plates, multiple vias, and external loads such as decoupling capacitors. Each parallel-plate pair, which consists of two consecutive conductor plates functioning as either power or ground in the PCBs or packages, is modeled as one individual microwave network. Equivalent circuits are used in the microwave network to model the vias, and a parallel-plate impedance matrix is formulated to account for the wave interactions between the vias and the boundary of the PCB or package. If signal traces are present in a plate pair, a modal decomposition and recombination approach is employed to model two associated modes: the transmission line mode for the signal traces, and the parallel-plate mode for the power-ground plate pair. The microwave networks for each plate pair are finally cascaded together by enforcing the continuity of the voltages and currents at the via clearance holes in the conductor plate shared by two consecutive plate pairs. Numerical validation reveals that the cascaded microwave network approach produces accurate simulation results with much less central processing unit time and memory requirements than 3-D full-wave approaches.
Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

En-Xiao Liu,Er-Ping Li,Zaw,Xingchang Wei,Yaojiang Zhang,Ruediger Vahldieck

DOI: https://doi.org/10.1109/tmtt.2009.2022883

IF: 4.3

2009-01-01

IEEE Transactions on Microwave Theory and Techniques

Abstract:This paper presents novel modeling methods for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. The new modeling methods address two open problems related to the modal expansion with the T-matrix method for the analysis of via coupling. First, a novel boundary modeling method, called the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling. In the FDCL, virtual cylinders with dynamic radii are postulated to approximate the original finite-sized boundary of parallel-plate structures. Second, a generalized T-matrix model, which is derived by the mode-matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. With the two open problems successfully solved, the modal expansion with the T-matrix method incorporating the FDCL boundary modeling method and the generalized T-matrix model can now be fully utilized for efficient and accurate analysis of finite-sized multilayered parallel-plate structures with a large number of vias. Both numerical and experimental verifications are presented to validate the new modeling methods.
Modeling of Advanced Multilayered Packages with Multiple Vias and Finite Ground Planes

En-Xiao Liu,Xingchang Wei,Zaw,Er-Ping Li,Le-Wei Li

DOI: https://doi.org/10.1109/epep.2007.4387180

2007-01-01

Abstract:A system-level modeling approach, which combines the MoM (method of moments) and the SMM (scattering matrix method) has been presented for the modeling of advanced electronic packages (Oo et al., 2007). The focus of this paper is on addressing the problems of multilayered multiple via coupling and finite ground effects by the SMM method. Significant extensions of the SMM method facilitate the modeling of coupling among densely populated vias in multilayered packages with finite power/ground planes. The proposed approach is suitable for the signal and power integrity, and even EMI analysis of packages at system level.
Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks

W. Z. Zhang,E. X. Liu,E. P. Li

DOI: https://doi.org/10.1109/eptc.2012.6507159

2012-01-01

Abstract:In the paper, a domain decomposition procedure for the structure of multilayer power/ground planes is presented in the way that the spatial computational domain of PCBs/packages is decomposed as a collection of sub-domains: bounded parallel plane pairs and open plane areas. The pairs and areas are modeled as multiport microwave networks and connected by maintaining the continuity of tangential fields along the boundary of sub-domains. The second contribution of the paper is to propose S-Parameters representing the multiport networks and introduce the connection networks to maintain the continuity of voltages and equivalent currents. Using S-Parameters will make the computation stable while applying (and/or approaching) the boundary conditions of perfect electric conductor (PEC) and perfect magnetic conductor (PMC). The formulation of multiport network of a parallel plane pair is detailed, and how vias and striplines in the parallel plane pair are considered in the formulation is discussed. Finally, the solving method of an interconnected general S-Parameters based microwave network system is presented.
New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages

Zaw Zaw Oo,Enxiao Liu,Erping Li

DOI: https://doi.org/10.1109/EPTC.2011.6184407

2011-01-01

Abstract:A new equivalent circuit model is presented for modeling a differential pair of through-hole vias in multilayered electronic packages. The differential pair of through-hole vias, which share same anti-pad clearance, is analyzed and an equivalent circuit model for the differential vias is analytically derived from the electro- and magneto-quasi-static relations of the E and H fields along with the intrinsic via circuit model. The proposed circuit model is numerically validated and integrated to a systematic analysis of microwave network approach for power and signal integrity simulation in multilayered electronic packages. © 2011 IEEE.
A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages with Large Number of Vias

Zaw,En-Xiao Liu,Er-Ping Li,Xingchang Wei,Yaojiang Zhang,Mark Tan,Le-Wei Joshua Li,Ruediger Vahldieck

DOI: https://doi.org/10.1109/tadvp.2008.923379

2008-01-01

IEEE Transactions on Advanced Packaging

Abstract:This paper presents a semi-analytical approach for electrical performance modeling of complex electronic packages with multiple power/ground planes and large number of vias. The method is based on the modal expansion technique and the method of moments. For the inner package domain with multiple power/ground planes and many vias, the modal expansion method is employed to compute the electromagnetic fields from which the multiport network parameters, e.g., the admittance matrix can be easily obtained. For the top/bottom domain of signal layers, the moment method is used to extract the equivalent resistance, inductance, capacitance, and conductance (RLCG) parameters. The equivalent circuit for the entire package is then generated by combining the results. for both package domains. The equivalent circuit can be used in a SPICE-like simulator to study the signal and power integrity of an electronic package. Numerical examples demonstrate that the new approach is able to provide fast yet accurate signal and power integrity analysis of multilayered electronic packages.
"Smart" 3D Electromagnetic Modeling

B. M. Kolundzija,T. S. Milosevic,M. S. Pavlovic,Wen-Yan Yin

DOI: https://doi.org/10.1109/IEEECONF35879.2020.9330209

2020-01-01

Abstract:Techniques for "smart" 3D EM modeling are briefly recollected and described. By applying these techniques to a 3-layer printed dipole antenna, which is coaxially fed through finite sized reflector, the number of unknowns in MoM/SIE approach is reduced for an order of magnitude with negligible loss of accuracy. Such minimalistic model enabled full wave simulation of array of 28 by 28 elements at PC computer.
Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs

Wensheng Zhao,Wenyan Yin,Xiaopeng Wang,XiaoLong Xu

DOI: https://doi.org/10.1109/TED.2011.2162848

IF: 3.1

2011-01-01

IEEE Transactions on Electron Devices

Abstract:Temperature-dependent investigations of circular and square coaxial through-silicon vias (C-TSVs) are carried out in this paper, which can provide an effective solution to suppressing various couplings, such as intra- and intersubstrate, and crosstalk among multi-TSVs. An equivalent lumped-element circuit model is proposed for both C-TSVs, and their parasitic capacitance values, per-unit-height di...
Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

Wensheng Zhao,Xiaopeng Wang,XiaoLong Xu,Wenyan Yin

DOI: https://doi.org/10.1109/EDAPS.2010.5683012

2010-01-01

Abstract:An equivalent lumped- element circuit model of coaxial TSV is proposed in this paper, in which both frequency-and temperature-dependent elements are extracted using the partialelement equivalent-circuit (PEEC) method. One important aspect of coaxial TSV modelling is its capacitance extraction, in which MOS effects are taken into account. The circuit model is also reduced to a transmission line one, with its transmission characteristics predicted theoretically for the silicon material but with different resistivities.
Signal Integrity Analysis of Through-Silicon Via Based 3D Integrated Circuit

Er-Ping Li,En-Xiao Liu

DOI: https://doi.org/10.1109/issse.2010.5606942

2010-01-01

Abstract:This paper presents an accurate compact scalable RLCG (Resistance, Inductance, Capacitance, and Conductance) model for electrical modeling of through-silicon vias in 3D IC packaging. Closed-form formulas for R and L are derived by full-wave approach, while C and G are taken from static solutions. The equivalent circuit model can capture almost all the parasitic effects, such as skin, proximity and MOS capacitance effect of through-silicon vias and the effect of lossy silicon. Therefore, it yields accurate results comparable to the full-wave solver.
Analysis of Multiple Vias Coupling in Silicon Interposer by Using Cylindrical Mode Expansion Method

Jun Li,Xing-Chang Wei,Er-Ping Li

DOI: https://doi.org/10.1109/ursigass.2014.6929544

2014-01-01

Abstract:This paper presented a cylindrical mode expansion method for the analysis of the coupling between multiple through silicon vias (TSV) in silicon interposer. The scattering and multi reflection effects between the vertical cylindrical vias are considered by expanding the electromagnetic files surrounding the vias by cylindrical waves. As the method fully captured the physical mechanism of the wave interaction between multiple vias, it can give a high accuracy and fast solution. Based on this method, the effect of the grounded TSVs for the reduction of electromagnetic interference is efficiently analyzed.
Method for system-level signal and power integrity modeling of high-speed electronic packages

enxiao liu,xingchang wei,zaw zaw oo,yaojiang zhang,wenzu zhang,erping li

DOI: https://doi.org/10.1109/EPTC.2009.5416566

2009-01-01

Abstract:This paper reported the latest development of the modal decomposition with T-matrix method for accurate and efficient analysis of coupling of multiple vias in finite-sized multilayered parallel-plate structures. A novel boundary modeling method, named the frequency-dependent cylinder layer (FDCL), is proposed to resolve the open problem of boundary modeling associated with modal expansion methods. Moreover, a generalized T matrix model derived by the mode matching technique, is created to characterize the coupling effect for vias penetrating more than one layer in a multilayered structure. Both numerical and experimental verifications are presented to validate the new modeling methods. The above method has been incorporated into the simulation tool developed recently by us.
PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Guang-Xiao Luo,Er-Ping Li,Xing-Chang Wei,Xiang Cui,Ran Hao

DOI: https://doi.org/10.1109/temc.2014.2312356

IF: 2.036

2014-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The power distribution network (PDN) impedance of 3-D-through silicon vias (TSVs) interposer layer is modeled by considering the metal-oxide-semiconductor (MOS) structure effects. The Lambert W function is proposed to simulate the change of depletion width with the bias voltage in the static field, and the high-frequency MOS capacitance is obtained while considering the charges at the semiconductor-insulator interface. Furthermore, based on the depletion width and the insulating dielectric layer assumption, the electrical model of power-ground TSVs pair is presented by combining the MOS capacitance with TSVs parasitic RLGC (resistance-inductance-capacitance-conductance). Finally, the PDN impedance characteristics of the 3-D-IC integrated system with multiple TSVs are performed by using the proposed multitransmission line and model reduction methods, and the importance of the capacitance is presented.
Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

Zaw,Liu Enxiao,Wei Xing Chang,Li Erpirig,Chua Eng Kee,Li Le-Wei

DOI: https://doi.org/10.1109/eptc.2007.4469749

2007-01-01

Abstract:A novel co-simulation method for signal traces with large number of vertical power/ground vias in electronic package using a coupled scattering matrix method (SMM) with integral equation (IE) method is presented. The SMM for the parallel- plate waveguide modes is developed using the Foldy-Lax equations to analyze the scattering effects between the P/G vias. Two-port admittance (Y) matrix is modeled to represent multiple scattering of the P/G vias with signal vias. The IE method is used to extract equivalent circuit models for coupling between external signal traces and the vertical vias. The extracted model is co-simulated with the Y-matrix for signal response.
Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package

Zaw Oo Zaw,Xing Chang Wei,En-Xiao Liu,Er-Ping Li,Le-Wei Li

DOI: https://doi.org/10.1109/epep.2008.4675886

2008-01-01

Abstract:Efficient modeling method is presented for analysis of multilayer power-ground planes with multiple vias coupled to signal traces in an electronic package. A key feature of the proposed method is that applying modal decoupling in power distribution network (PDN) of the package to extract equivalent network parameters. The method has been experimentally validated and examined.
A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots

Xing-Chang Wei,Zhi-Guo Shi,Er-Ping Li

DOI: https://doi.org/10.1109/temc.2010.2064320

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:Resonance characteristics of power and ground planes with narrowslots are very important for the electromagnetic compatibility design of high-speed digital circuits. To efficiently and accurately model such resonance characteristics, we propose a novel combined equivalent networks method. By using the modal-decoupling technology, the whole gapped power and ground planes are decoupled into two subdomains: the power and ground planes, and the slots, which support parallel plate mode and slot mode, respectively. After this, efficient integral equations are created on each subdomain. The integration paths are discretized into small segments, on which network ports are defined. In this way, these two subdomains are equivalent to two microwave networks. The impedance and admittance matrices of the equivalent networks are extracted through the moments method solution of the created integral equations. Finally, these two equivalent networks are connected together to consider the mode conversion between the parallel plate mode and slot mode. The proposed method is very efficient for the analysis of power integrity of the gapped power and ground planes. By comparing with available full-wave methods, the accuracy and efficiency of the proposed method are verified.
A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues

xing chang wei,e x liu,z z ooi,e p li,rudiger vahldieck

DOI: https://doi.org/10.1109/ECTC.2007.374016

2007-01-01

Abstract:The electromagnetic compatibility simulation of the power delivery network inside the integrated circuit packaging becomes an important issue in the modern circuit design. In this paper, this complex power-ground plane is divided into the internal region and external region. These two regions are simulated by using the hybrid integral equations. The internal integral equation is described by using the rectangular cavity dyadic green functions, while the external integral equation is described by using the free-space green function. These two equations are coupled through the equivalent magnetic current placed on the periphery and gaps of the power-ground plane. This proposed method could accurately simulate both the coupling between vias inside the power-ground plane and the emission from the periphery and gaps of the power-ground plane. Through several examples, its accuracy and efficiency are validated.
Hybrid of Scattering Matrix Method and Integral Equation Used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias

Zaw,En-Xiao Liu,XingChang Wei,Yaojiang Zhang,Le-Wei Li

DOI: https://doi.org/10.1109/ectc.2007.373892

2007-01-01

Abstract:The paper presents the development of a coupled scattering matrix method (SMM) with integral equation method for analyzing the power integrity (PI) of multilayered package structure with large number of power/ground vias. Analysis of the entire signal traces and the associated vias, connected between the power and ground, (named as P/G vias) is treated as analyzing the coupling between the external signal traces and the inside vertical vias, and analyzing the scattering effects between the vertical vias. A pair of the layered power/ground planes is considered as the parallel-plate waveguide structure. The scattering matrix method for the parallel-plate waveguide modes is developed by using the Foldy-Lax equations to analyze the scattering effects between the vertical P/G vias. The equivalent layered vias are modeled for the vertical vias connected between the power/grounds planes. The scattering matrices for coupling between the P/G vias including the signal vias are computed, and hence the outgoing wave coefficients for each via are calculated for power integrity analysis. The admittance (Y) matrix of a two-port network is modeled to represent the multiple scattering of the vertical P/G vias with the signal vias. The integral equation method is used to extract the equivalent circuit models for coupling between the external signal traces and the vertical vias. The extracted models are simulated together with the Y-matrix for signal response.
A NOVEL COUPLED T-MATRIX AND MICROWAVE NETWORK APPROACH FOR MULTIPLE SCATTERING FROM PARALLEL SEMICIRCULAR CHANNELS WITH ECCENTRIC CYLINDRICAL INCLUSIONS

Y. -J. Zhang,A. Bauer,E. -P. Li

DOI: https://doi.org/10.2528/pier04083102

2005-01-01

Abstract:A novel coupled T-matrix and microwave network approach is proposed for the multiple scattering from parallel semicircular channels. First, an equivalent network is set up to derive the T-matrix of a single channel, in which the S-parameters are derived for the semicircular boundary and the T-matrix of the inclusive cylinders is served as loading matrix of s-parameters. In addition, the T-matrix of the inclusive cylinders is obtained from the T-matrix of each cylinder in its local coordinates using the addition theorem of cylindrical harmonics. Thus, the T-matrix description of semicircular channels could be obtained steadily by the equivalent microwave network theory. Second, the addition theorems in half space are derived and utilized to take account of multiple scattering from several parallel channels. Comparing with previous dual-series eigenfunction solutions, the coupled method simplifies the analysis and could handle much more complex structures step by step. The method is verified by comparison with previous publications and both TM and TE wave illumination are considered.

Systematic Microwave Network Analysis for 3D Integrated Systems

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

Modeling of Advanced Multilayered Packages with Multiple Vias and Finite Ground Planes

Modeling Multilayer Power/ground Planes in Printed Circuit Boards and Electronic Packages Using Microwave Networks

New circuit model for modeling differential pair of through-hole vias in multilayered electronic packages

A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages with Large Number of Vias

"Smart" 3D Electromagnetic Modeling

Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs

Electrothermal modeling of coaxial through silicon via (TSV) for three-dimensional ICs

Signal Integrity Analysis of Through-Silicon Via Based 3D Integrated Circuit

Analysis of Multiple Vias Coupling in Silicon Interposer by Using Cylindrical Mode Expansion Method

Method for system-level signal and power integrity modeling of high-speed electronic packages

PDN Impedance Modeling for Multiple Through Vias Array in Doped Silicon

Novel Co-Simulation Method for Analysis of Power Integrity and EMI in Electronic Packages with Large Number of Power/ground Vias

Efficient Analysis for Multilayer Power-Ground Planes with Multiple Vias and Signal Traces in an Advanced Electronic Package

A Novel Combined Equivalent Networks Analysis for Power and Ground Planes with Narrow Slots

A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity Issues

Hybrid of Scattering Matrix Method and Integral Equation Used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias

A NOVEL COUPLED T-MATRIX AND MICROWAVE NETWORK APPROACH FOR MULTIPLE SCATTERING FROM PARALLEL SEMICIRCULAR CHANNELS WITH ECCENTRIC CYLINDRICAL INCLUSIONS