A Locally Boron-Doped Diamond Tool for Self-Sensing of Cutting Temperature: Lower Thermal Capacity and Broader Applications
Shiquan Liu,Liang An,Xiaozhou Chen,Zhongwei Li,Mingyu Duan,Fuming Deng,Bing-Feng Ju,Yuan-Liu Chen
DOI: https://doi.org/10.1007/s00170-024-14703-4
2024-01-01
Abstract:Accurately measuring the cutting temperature in micro cutting zone is crucial for characterizing and optimizing the cutting status during ultra-precision machining. This work proposes an innovative method for self-sensing of cutting temperature using a locally boron-doped diamond tool. A longitudinal layered deposition synthesis methodology, instead of the traditional growth method under high temperature and high pressure conditions (HTHP), was developed to enable the fabrication of the locally boron-doped diamond tool. The doping contents, lattice integrity, and electrical properties of the diamond were characterized. Owing to the inherently low thermal capacity and quick carrier migration induced by the thin-layer structure for sensing temperature, the diamond tool has the advantages of rapid response and enhanced sensitivity, compared with traditional cutting temperature measurement technologies. An insulated diamond tool edge without boron doping enables to accurately measure cutting temperature for various conductive materials in ultra-precision cutting processes. The locally boron-doped diamond tool was employed for in-process monitoring of the temperature in micro cutting zone during ultra-precision machining processes. The experimental results demonstrated the capabilities of in-process cutting temperature monitoring of conductive materials using the diamond tool, as well as the high-sensitivity identification of micro/nano morphologies and defects on machined surface based on the measured temperature. It provides a potential approach for advanced status analysis and diagnosis in the process of ultra-precision machining.