Self-sensing of Cutting Temperature in Single Point Diamond Turning by a Boron-Doped Diamond Tool

Yuan-Liu Chen,Shiquan Liu,Xiaozhou Chen,Fuming Deng
DOI: https://doi.org/10.1016/j.cirp.2023.04.048
IF: 4.482
2023-01-01
CIRP Annals
Abstract:Cutting temperature is important in single point diamond turning. However, the challenge of measuring temperature in single point diamond turning is locating a sensor at the cutting edge during machining. This paper presents a tool system having a capability of measuring cutting temperature in diamond turning by the tool itself without any additional temperature sensors. A diamond tool was doped with boron via high temperature and high pressure treatment, by which the tool becomes a P-type semiconductor and thus have a thermal-sensitive characteristic for indicating the cutting temperature at the cutting edge zone during diamond turning processes.
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