Abstract:The manifold microchannel heat sink shows great potential for cooling high-heat-flux electronic equipment owing to its exceptional thermal and flow performance. A new manifold ring-shaped channel design is introduced to improve the temperature uniformity for circular heat sources. A comparative analysis of the manifold straight channel, radial expansion channel and manifold ring-shaped channel designs is conducted based on the same heating area under equal mass flow conditions by numerical investigation using single-phase de-ionized water. The findings indicate that the newly proposed manifold ring-shaped channel design exhibits a lower maximum temperature, a lower average temperature, a better temperature uniformity and a smaller pressure drop in comparison to the straight channel and radial channel designs. Specifically, at a mass flow rate of 2.5 g/s, the ring-shaped channel design demonstrates a 71.4 % and 45.4 % reduction in the temperature difference between the maximum temperature and the minimum temperature of the heating surface, and the coefficient of performance is enhanced by 458.2 % and 169.7 % when compared to the straight channel and radial channel designs, respectively. Additionally, three improved designs based on the original manifold ring-shaped channel design are proposed to further enhance fluid flow distribution in the ring-shaped channel design. The results reveal that all three manifold ring-shaped channel optimizations further lower the maximum temperature, the average temperature and the temperature difference. Notably, the improved case3 exhibits the best thermal and hydraulic performances among all structures. When compared to straight channel and radial channel designs, the improved case3 demonstrates an 86.9 % and 75.0 % reduction in the temperature difference, and an increase of 201.2 % and 523.4 % in coefficient of performance under the equal mass flow comparison basis. A heat flux of 1200 W/cm2 can be dissipated at 6 g/s when the maximum temperature rise is kept below 60 K, with a pressure drop of 38 kPa.

Experimental Investigations of Manifold Structure on Cooling Performance in Embedded Microfluidic Cooling.

Advancing Cryogenic Electronic Cooling: A Case Study on Embedded Manifold Microchannels in Micromachined Joule-Thomson Coolers

An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding.

Investigation of flow and heat transfer performance of the manifold microchannel with different manifold arrangements

Study of Different Cooling Structures on the Thermal Status of an Internal Combustion Engine

Numerical investigation of novel manifold microchannel heat sinks with countercurrent regions

Thermal and hydrodynamic characteristics of single-phase flow in manifold microchannels with countercurrent regions

Investigation of Z-type Manifold Microchannel Cooling for Ultra-High Heat Flux Dissipation in Power Electronic Devices

Investigation of heat transfer performance of the manifold microchannel heat sink with different interface configurations

Numerical Study on a New Manifold Ring-Shaped Microchannel Structure for Circular Heat Source with Excellent Temperature Uniformity

Numerical study on thermal and hydraulic performances of a hybrid manifold microchannel with bifurcations for electronics cooling

Effects of Manifold Designs on Flow and Thermal Performances of Microchannel Heat Sink

Structure Optimization for Passages in Hydraulic Manifolds Using Metal Additive Manufacturing Technology

Study on the flow and heat transfer characteristics of pin-fin manifold microchannel heat sink

Flow Manifold Optimization for a Uniform Velocity Distribution in a Laminated Microreactor with Micro‐Pin‐Fin Arrays

Experimental and numerical study of structural parameters on the heat transfer performance of submerged cooling system

Cooling Characteristics with Microchanneled Structures

Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (Mmc-Esifo) Package

Optimization of Manifold Mmicrochannel Heat Sink Based on Equivalent Resistance Model

Experimental study of embedded manifold staggered pin-fin microchannel heat sink

Embedded microfluidic cooling with compact double H type manifold microchannels for large-area high-power chips