Investigation of heat transfer performance of the manifold microchannel heat sink with different interface configurations

Haozhe Kang,Xuesong Mei,Kaida Xu,Jianlei Cui
DOI: https://doi.org/10.1016/j.icheatmasstransfer.2024.107807
IF: 6.782
2024-09-03
International Communications in Heat and Mass Transfer
Abstract:Increasingly higher thermal power densities pose significant challenges to the operational longevity of electronic devices, simultaneously constraining further advancements in their performance and integration. Manifold microchannel heat sinks (MMHSs) offer a promising solution to mitigate these challenges. However, limited by manufacturing technology, manifold microchannel heat sinks often necessitate the assembly of multiple components, introducing interfaces with lower thermal conductivity. This study uses numerical simulations to thoroughly examine the heat transfer properties of manifold microchannel heat sinks with varying interface configurations. The cooling capability of these heat sinks is investigated under varying thermal conductivities of the interfaces. The findings underscore that enhancing interface thermal conductivity or eliminating interfaces can yield significant benefits, including improved temperature uniformity within the heat sink, reduced maximum bottom wall temperatures, and enhanced overall heat transfer coefficients. Additionally, a thorough examination was conducted to assess the impact of inlet volume flow and bottom wall heat flux on these enhancements. Remarkably, under a heat flux of 1000 W cm −2 , compared to a two-interface heat sink, a no-interface heat sink can reduce the maximum bottom wall temperature by up to 4.1 K, improving bottom wall and heat sink temperature uniformity by 19.1% and 47.9%, respectively.
thermodynamics,mechanics
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