Abstract:3D numerical microchannel heat sink model was developed to investigate a heat sink design using a manifold with baffles.The heat sink was modeled by simultaneously solving the Navier-Stokes equations and the energy equation for the liquid domain and the heat conduction equation for solid substrate,with the results agreeing well with reported experimental data.The results show that the serpentine design with 1 to 6 bends increases the flow rate in each tube and induce alternating counter-parallel cross flows significantly,which improve the heat transfer and temperature uniformity in the microchannel heat sink compared with parallel and Z flow type designs for the same pumping power.Both the Z type and parallel manifold designs have difficulty matching the heat transfer rates in the serpentine design for low pumping powers,with very huge pumping powers needed to get the same heat flux.The temperature distribution along the central line at the bottoms for various bends in the serpentine manifold design illustrates that the temperature non-uniformity is not improved by using more than four bends.More power needed to feed the refrigerant into the microchannels with more bends.Thus,there is an optimal number of bends for the serpentine design.

Effects of Manifold Designs on Flow and Thermal Performances of Microchannel Heat Sink