Influence of Microstructure Evolution on the Electroconducting Behavior of Intragranular TiN/ZTM Nanocomposites

Xiaoning Jin,Lian Gao,Jingguo Li,Shan Zheng
DOI: https://doi.org/10.1111/j.1551-2916.2004.00162.x
IF: 4.186
2004-01-01
Journal of the American Ceramic Society
Abstract:Electroconductive zirconia‐toughened mullite (TiN/ZTM) intragranular nanocomposite was fabricated by hot‐pressing a powder mixture of nano‐sized TiN, ZrO 2 (2Y), and mullite gel. The material showed a good sinterability and could be highly densified at a low temperature of 1300°3C. Sintering temperature strongly influenced the microstructure and electrical resistivity of the material. The electrical resistivity increased monotonously from 20 Ω‐cm to 1.5 times 10 6 °3Cm, as the sintering temperature was increased from 1300° to 1500°3C. TEM results indicated that such a phenomenon could be ascribed to the changes in the microstructure of the material, which led to a decrease in the connectivity of the TiN network in the sample as the sintering temperature was increased.
What problem does this paper attempt to address?