Rapid and Facile Characterization of Dislocations in Cross-Sectional GaAs/Si Films Using Electron Channeling Contrast Imaging

Chen Jiang,Hao Liu,Jian Li,Yidong Zhang,Chuanchuan Li,Jun Wang,Qi Wang,Xin Wei,Xiaomin Ren
DOI: https://doi.org/10.1117/12.2647200
2022-01-01
Abstract:Electron channeling contrast imaging (ECCI), as a rapid and convenient technique, has been widely used to characterize dislocations of heteroepitaxial III-V materials in recent years. The previous ECCI measurements, however, were primarily based on plan-view ones. In this work, we demonstrate an experimental observation of the cross-sectional ECCI measurement on a Si-based GaAs sample for the first time. The plan-view ECCI image can provide information on threading dislocations, stacking faults, as well as the dislocation distribution. By investigating the relationship between the defect contrast and the corresponding accelerating voltage, the optimal range of beam voltages for cross-sectional ECCI measurement is 10 kV-15 kV. The cross-sectional ECCI can simplify the process of characterizing dislocations in Si-based III-V materials.
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