EBIC study of dislocations and stacking faults in 4 H-SiC homoepitaxial films

Bin Chen,Jun Chen,Takashi Sekiguchi,Takasumi Ohyanagi,Hirofumi Matsuhata,Akimasa,Kinoshita,Hajime Okumura,Filippo Fabbri
2008-01-01
Abstract:The electrical properties of dislocations and stacking faults in 4H-SiC homoepitaxial films with 8 ̊ off from the (0001) Si surface were investigated by using electron-beam-induced current (EBIC) technique. First, four different dislocations, namely basal plane, screw, edge-I and edge-II dislocations, were revealed by molten KOH etching. EBIC observation shows the electrical activity of basal plane dislocation (BPD) is the strongest and becomes weaker in this order. Moreover, it is found that, under the electron beam irradiation, the BPDs dissociates into two partials with stacking faults between them. In the EBIC image, stacking faults were seen as a bright area, which is peculiar to this material. The mechanism of this bright contrast was discussed in terms of the energy state of stacking faults.
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