Abstract:Industry 4.0 has been a hot topic in recent years. The process of integrating Cyber-Physical Systems (CPS), Artificial Intelligence (AI), and Internet of Things (IoT) technology, will become the trend in future construction of smart factories. In the past, smart factories were developed around the concept of the Flexible Manufacturing System (FMS). Most parts of the quality management process still needed to be implemented by Automated Optical Inspection (AOI) methods which required human resources and time to perform second stage testing. Screening standards also resulted in the elimination of about 30% of the products. In this study, we sort and analyze several Region-based Convolutional Neural Network (R-CNN) and YOLO models that are currently more advanced and widely used, analyze the methods and development problems of the various models, and propose a suitable real-time image recognition model and architecture suitable for Integrated Circuit Board (ICB) in manufacturing process. The goal of the first stage of this study is to collect and use different types of ICBs as model training data sets, and establish a preliminary image recognition model that can classify and predict different types of ICBs based on different feature points. The second stage explores image augmentation fusion and optimization methods. The data augmentation method used in this study can reach an average accuracy of 96.53%. In the final stage, there is discussion of the applicability of the model to detect and recognize the ICB directionality in <1 s with a 98% accuracy rate to meet the real-time requirements of smart manufacturing. Accurate and instant object image recognition in the smart manufacturing process can save manpower required for testing, improve equipment effectiveness, and increase both the production capacity and the yield rate of the production line. The proposed model improves the overall manufacturing process.

Domain-Integrated Machine Learning for IC Image Analysis

Deep Learning-Based Image Analysis Framework for Hardware Assurance of Digital Integrated Circuits

Accelerating Chip Design with Machine Learning: from Pre-Silicon to Post-Silicon

Deep Learning for Automatic IC Image Analysis.

Deep Learning for Industrial Image: Challenges, Methods for Enriching the Sample Space and Restricting the Hypothesis Space, and Possible Issue

A Hierarchical Multiclassifier System for Automated Analysis of Delayered IC Images

Delayered IC Image Analysis with Template-Based Tanimoto Convolution and Morphological Decision.

Deep Learning-Based Integrated Circuit Surface Defect Detection: Addressing Information Density Imbalance for Industrial Application

Application and possibility of machine learning in integrated circuit design

Hybrid Unsupervised Clustering for Pretext Distribution Learning in IC Image Analysis

Integrated Circuit Board Object Detection and Image Augmentation Fusion Model Based on YOLO

ICML: Machine Learning-based Transistor-level Integrated Circuit Layout Error Classification using Color Analysis and Segmentation

Machine Learning for 3D-IC Electric-Thermal Simulation and Management

Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy

An Adaptive Deep Learning Framework for Fast Recognition of Integrated Circuit Markings

Unsupervised Graph-Based Image Clustering for Pretext Distribution Learning in IC Assurance

Automatic Error Detection in Integrated Circuits Image Segmentation: A Data-driven Approach.

A Deep Transfer Learning Model for Packaged Integrated Circuit Failure Detection by Terahertz Imaging

Semantic-Masked Intensity Augmentation for Deep Learning-based Analysis of FPGA Images

Implementation of Machine Learning in VLSI Integrated Circuit Design

Accelerating Domain-Aware Electron Microscopy Analysis Using Deep Learning Models with Synthetic Data and Image-Wide Confidence Scoring