Abstract:In this study, we aimed to address the primary challenges encountered in industrial integrated circuit (IC) surface defect detection, particularly focusing on the imbalance in information density arising from difficulties in data sample collection. To this end, we have developed a new hybrid architecture model for IC surface defect detection (SDDM), based on ResNet and Vision Transformer (ViT). The core innovation of SDDM lies in the integration of the concepts of image information density and dataset information density, effectively identifying and processing areas of high information density through multi-channel image segmentation techniques. The convolution operations performed within each patch of the model help to precisely capture positional information, thereby meticulously differentiating the complex details on the surface defect detection of ICs. We optimized the model to make it more suitable for industrial applications, significantly reducing computational and operational costs. The experimental results confirmed that the improved SDDM model achieved an accuracy rate of 98.6% on datasets with uneven information density, effectively enhancing the productivity of IC packaging and testing companies, particularly in handling datasets with imbalanced information density.
What problem does this paper attempt to address?
The paper attempts to address the main challenges encountered in Industrial Integrated Circuit Surface Defect Detection (IC Surface Defect Detection, SDD), particularly the issue of information density imbalance caused by the difficulty in collecting data samples. Specifically, the paper focuses on the following aspects:
1. **The challenge of identifying multiple defect types**: In actual industrial production, there are numerous types of surface defects on integrated circuits, such as surface scratches, cover scratches, pin defects, character loss, unclear printing, and glue overflow. This requires the model to recognize various defect types and possess a certain degree of generalization and rapid learning ability to maintain production efficiency.
2. **The need to improve detection accuracy**: With the development of integrated circuit technology, IC sizes are continuously shrinking, making it increasingly difficult to identify IC surface defects. Some defects, such as character loss or uneven character width, require very high detection accuracy, typically needing to be identified at the scale of tens of micrometers.
3. **The difficulty of dataset collection**: Modern industrial processes are continuously optimized, leading to a reduction in the number of defect samples. In typical datasets, the number of "normal" samples far exceeds the number of "defect" or "abnormal" samples. This sample imbalance phenomenon severely hinders the application of machine learning-based models.
4. **Challenges brought by dataset diversity**: Due to the strict control of IC surface defect products by manufacturing companies, collecting datasets is very difficult. Images usually need to be collected from different factories, data acquisition devices, and shooting environments, resulting in inconsistencies in image resolution, size, and information density. This makes the actual dataset significantly different from standard datasets (such as ImageNet), making it unsuitable for direct processing by machine learning models.
5. **Challenges in the actual production process**: In the process of IC surface defect detection, IC specifications and types are diverse and constantly changing. Additionally, the detection speed requirements are very high, and the use of fixed-focus lenses limits the continuous focusing ability of the camera. To adapt to different specifications and types of ICs and meet high-speed detection requirements, detection equipment needs to find a balance between cost and performance.
To address the above issues, the paper proposes a hybrid architecture model SDDM (Surface Defect Detection Model) based on deep learning. This model combines the advantages of ResNet and Vision Transformer (ViT) and effectively identifies and processes high information density areas through multi-channel image segmentation technology and convolution operations, thereby improving the accuracy and efficiency of IC surface defect detection. Experimental results show that the improved SDDM model achieved an accuracy of 98.6% when processing datasets with imbalanced information density, significantly enhancing the production efficiency of IC packaging and testing companies.