Weakly Supervised End-to-End Learning for Inspection on Multidirectional Integrated Circuit Markings in Surface Mount Technology
Zhongshu Chen,Lin Zuo,Feng Guo,Changhua Zhang,Yu Liu
DOI: https://doi.org/10.1109/tii.2023.3301065
IF: 12.3
2023-01-01
IEEE Transactions on Industrial Informatics
Abstract:Integrated circuit (IC) marking inspection is a crucial task to ensure product quality in electronics manufacturing. Due to the diversity of marking appearance, high environmental complexity, and massive annotation costs, it is, however, still a great challenge to accurately recognize IC markings in a real-time fashion at some production stages, such as surface mount technology (SMT). In this article, an end-to-end deep learning model with three branches is put forth for IC marking inspection. The saliency activation branch provides powerful shared feature representation, and by incorporating with the weakly supervised mechanism, it can generate precise character localization information with coarse-grained annotation. The direction recognition and character recognition branches utilize shared saliency maps to sample word-level and character-level features, respectively, such that the network can properly recognize markings in different orientations, and especially perform well on the chips with multidirectional markings. The proposed character box refinement method allows the network to adapt to tiny size and tight-layout IC markings, and a new loss function called ED-Loss is designed for error estimation between the unaligned sequences. Experiments on a real SMT chip dataset with highly diverse IC images show that the model reaches a recall rate of 96.34%, with an inspection speed close to 30 fps. The comparative experiments with the state-of-the-art models demonstrate that our model has superior performances in terms of accuracy, efficiency, and adaptability.
automation & control systems,computer science, interdisciplinary applications,engineering, industrial