Abstract:Molecular dynamics is employed to study the mechanism of material removal and subsurface damage of monocrystalline silicon when it is under a nanoscale high-speed laser-assisted grinding of a diamond tip. Laser-assisted machining (LAM) is that the workpiece is locally heated by an intense laser beam before material removal. The effects of laser moving speed, laser pulse intensity and laser spot radius are thoroughly investigated in terms of atomic trajectories, phase transformation, temperature distribution, grinding temperature, grinding force and friction coefficient. The investigation shows that a higher laser moving speed reduces the subsurface damage and improves the material remove rate because of fewer atoms with five and six coordination atoms and more chips. Besides, both tangential grinding force (Fx) and normal grinding force (Fy) decrease as the laser moving speed increases. The distribution of high-temperature zone strongly depends upon the effect of laser pulse intensity and laser spot radius. Larger laser pulse intensity can make the material more fully softened before being removed. Moreover, as the laser pulse intensity becomes larger, the friction coefficients became smaller, the material remove rate improves and the depth of grinding increases. However, larger laser pulse intensity may result in a larger thermal deformation of workpiece. A larger laser spot radius reduces the grinding depth but increases the width of laser irradiation zone on machined surface. Thus, a suitable laser spot radius can improve the material removal rate. These results indicate that it is possible to control and adjust the laser parameters according to laser moving speed, laser pulse intensity and laser spot radius, and it provides a potential technology to improve a surface integrity and a smoothness of ground surface.

Thermal Effects on Removal Mechanism of Monocrystal SiC During Micro-Laser Assisted Nanogrinding Process

A Molecular Dynamics Investigation into the Mechanisms of Material Removal and Subsurface Damage of Nanoscale High Speed Laser-Assisted Machining

Laser-assisted grinding of RB-SiC composites: Laser ablation behavior and mechanism

Molecular Dynamics Simulations of Nano Grinding of Silicon Carbide (Sic)

Understanding Machinability Improvements and Removal Mechanism of Ceramic Matrix Composites During Laser-Ablating Assisted Grinding

Strain-rate Sensitivity of Brittle Deformation and Removal Mechanisms of Monocrystalline 3c–sic Induced by Nano Cutting Process

Laser ablation behavior and mechanism of Cf/C–SiC composites under different laser energy densities

Subsurface Damage Inhibiting and Synchronous Removal Behavior of Cf/SiC Composites with Laser-Induced Controllable Ablation During Abrasive Belt Grinding

Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization

Comprehensive Investigation into Grinding Characteristics and Damage Behavior of Cf/SiC Composite Modified by Picosecond-Laser Ablating

The ablation behavior and modification mechanism of SiC under different laser energy

Investigation on the Laser Ablation of SiC Ceramics Using Micro‐raman Mapping Technique

Laser-assisted Grinding of Reaction-Bonded SiC

Investigation on the impact of thermal softening effect induced by nanosecond pulsed laser-assisted cutting on the deformation mechanism of SiCp/Al composites

Investigate on Material Removal of 3C-Sic Crystals in Nano-Polishing Via Molecular Dynamics

Ablation Threshold and Material Removal Mechanisms of SiC Processed by Femtosecond Laser

Reducing Cf/SiC Composite Damages Through Collaborative Control of Laser Ablating Depth and Grinding Modes

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Surface Characteristics and Material Removal Mechanisms During Nanogrinding on C-face and Si-face of 4H-Sic Crystals: Experimental and Molecular Dynamics Insights

Simulation and experimental study on limited cutting and heat effect of silicon carbide

Mechanism analysis and process optimization of nanogrinding single-crystal SiC