Abstract:AbstractGSG‐PADs are mostly used structures in Integrated Circuits design. As the operating frequency increases, the coupling effect between the input and output GSG‐PADs is enhanced significantly. This causes signal energy leakage and impacts on the performance of adjacent devices in the system. Beyond microwave frequency, the coupling effect between the input and output of the GSG‐PADs is not only negligible but also varies in magnitude with respect to the connection methods of the GSG‐PADs in the circuit. Therefore, investigating the signal radiation properties of different GSG‐PADs connection methods is essential. Hence, three structures with different input and output ground PAD connection methods have been experimented. Based on the theoretical analysis of the electromagnetic field distribution between the pad network, a corresponding equivalent circuit model has been developed for the three structures. To validate the proposed model, the test structures were fabricated in 0.18 μm CMOS process and measured up to 67 GHz. The root‐mean‐square error (RMSE) of the magnitude of return loss and that of insertion loss are less than 0.013 and 0.003, respectively, when the measurement result is compared with the performance results of the proposed model. Finally, establish the complete model of the DUT and test pads to further verify the accuracy of the proposed two‐port GSG‐PADs model. Hence, the findings of the investigation can provide a theoretical basis for optimizing related layout in integrated circuit design.

Mechanism Analysis and Experiment of the Effects of the Guard Ring on the Inductors Performance

Modeling And Characterization Of Incomplete Shielding Effect Of Gnd On Common-Mode Emi Of A Power Converter

On-chip EMC issue: the implementation of patterned ground shields for silicon devices

The enhancement of Q factor for patterned ground shield inductors at high temperatures

Analysis of On-Chip GSG Pads Coupling Effects on Laterally-Coupled and Double-Stacked Inductors in the Millimeter-Wave Frequency Regime

The Investigation of the Substrates Noise Suppression Using Guard Rings in CMOS Technology

Effects of Grounded-Lid Apertures for Package-Level Electromagnetic Interference (EMI) Shielding

Modeling and Optimization of Substrate Electromagnetic Coupling and Isolation in Modern Lightly Doped CMOS Substrate

A circuit-oriented model for gapped power-ground planes

Efficient Modeling of Rerouted Return Currents in Multilayered Power-Ground Planes by Using Integral Equation

P-minus substrate guard ring modeling for the purpose of noise isolation in CMOS substrates

Analysis on the Commutation Loop Inductance of Different Cathode Regions in GCT Wafer

A STUDY OF INDUCTOR AND ITS MODEL IN SIGE BICMOS PROCESS

Effect of the Mutual Inductances among Grounding Conductors on the Transient Performance of Grounding Grids

Analysis the inductive coupling effects on the differential mode EMI in power converter

ANALYSIS ON THE EMI EFFECT OF STRAY MAGNETIC FIELD FROM MAIN CIRCUIT OF A PFC SWITCHED MODE POWER SUPPLY

The Investigation of the Signal Radiation Mechanism of Different GSG‐pads Connection Methods

Modeling and Suppression of Common-Mode Electromagnetic Interference in GaN-Based LLC Converter

Analysis of the Capacitor-Aided Meat Grinder Circuits for an Inductive Pulsed Power Supply

Influence of Geometrical Structure on Giant Magneto-Impedance (GMI) Effect in Multilayered Thin-film

Analysis and Equivalent-Circuit Model for CMOS On-Chip Multiple Coupled Inductors in the Millimeter-Wave Region