Abstract:The functional backfilling in mining achieves synergistic co-mining of deep-earth deposits-geothermal, and the development of functional filling materials with suitable phase change parameters and excellent physicochemical properties is imminent. This study aims to investigate the optimal composition of phase change energy storage backfill material based on MicroPCM. To address the issues of reduced compressive strength and specific heat capacity of MicroPCM-backfill, silicon carbide (SiC) is introduced to prepare MPSC-backfill. Box-Behnken Design (BBD) is proposed to design and analyze according to four factors (ash-sand ratio, slurry concentration, MicroPCM, SiC), three levels (compressive strength, thermal conductivity, specific heat capacity) and three center points. Based on the Response Surface Methodology, the multivariate quadratic polynomial model was used to perform multiple linear regression and binomial fitting analysis to explore the optimal ratio. Combined with SEM-EDS (Scanning Electron Microscope with Energy-Dispersive X-ray Spectroscopy) analysis, the following conclusions were drawn. SiC exhibits an overall enhancement of the compressive strength of the backfill, and the thermal conductivity tends to increase almost linearly. The specific heat capacity grows in a small amount of silicon carbide doping, but excessive amounts lead to a decrease, with an overall limited impact. The addition of SiC does not affect the phase change ability of MicroPCM. And within a certain range of added quantities, it optimizes specific heat capacity, thermal conductivity, and compressive strength. Experimental validation based on the obtained optimal composition shows errors within a 5% margin, indicating the response model's good accuracy and predictability. High and low-temperature cyclic tests confirm the long-term thermal energy storage stability of MPSC-backfill during phase change cycles.

Transient Thermal Management of SiC Power Modules by an In-Built Thermal Buffer Layer

Transient Performance of a Thermal Energy Storage-Based Heat Sink Using a Liquid Metal As the Phase Change Material

Direct Integration of Optimized Phase-Change Heat Spreaders Into SiC Power Module for Thermal Performance Improvements Under High Heat Flux

Experimental study on thermal behavior of PCM-module coupled with various cooling strategies under different temperatures and protocols

Insight into the Implication of High-Loading Mechanical Force on the Mechanical Bond

A Pore Scale Study on Heat Transfer Characteristics of Integrated Thermal Protection Structures with Phase Change Material

Thermal Network Modeling of Heat Dissipation Structure of Power Devices with PCM to Enhancing Short-Term Overload Capacity

Over-Current Capability of Silicon Carbide and Silicon Devices for Short Power Pulses with Copper and Phase Change Materials below the Chip

A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances

Recent advancement in the development of silicon-based phase change materials

Thermodynamic performance of SiC-enhanced MicroPCM backfill based on response surface methodology

An Evaluation on Thermal Performance Improvements for SiC Power Module Integrated with Vapor Chamber in MMC

Recent Advancement in the Development of Silicon‐based Phase Change Materials

Heat spreading performance of SiC-based power module with bonded vapour chamber for electric powertrain integration

Compact-Interleaved Packaging Method of Power Module With Dynamic Characterization of 4H-SiC MOSFET and Development of Power Electronic Converter at Extremely High Junction Temperature

A novel method to concurrently enhance heat conduction and natural convection inside PCM thermal buffer

Investigation of Low-Profile, High-Performance 62-mm SiC Power Module Package

Comparison of High Voltage SiC MOSFET and Si IGBT Power Module Thermal Performance

Study of a novel thermal management system using double-layer liquid-cooled plate-coupled PCM under high-rate discharge

Optimizing the design of composite phase change materials for high thermal power density

Finned Heat Pipe Assisted Low Melting Point Metal PCM Heat Sink Against Extremely High Power Thermal Shock