A novel method to concurrently enhance heat conduction and natural convection inside PCM thermal buffer

Bin Ding,Wen-Chuang Feng,Ming-Fei Mu,Liang Gong,Lin Li

DOI: https://doi.org/10.1016/j.ijheatmasstransfer.2022.123773

IF: 5.2

2022-12-26

International Journal of Heat and Mass Transfer

Abstract:A thermal buffer filled with phase change materials (PCM) can effectively prevent the intermittently working electronic devices from overheating and prolong the working time of the disposable electronic devices. This paper reported a novel composite PCM consisting of low-melting-temperature alloy bars embedded in pure paraffin that can concurrently improve thermal conductivity and natural convection during melting. Moreover, the effects of heat flux, filling height, and alloy mass fraction on the transient temperature of electronic devices and the effective protection time of thermal buffer were discussed experimentally. The results demonstrated that the heat conduction in stage one was enhanced by embedding alloy bars in pure paraffin, meanwhile the dripping of the alloy droplets in stage two not only enhanced the intensity of natural convection but also significantly delayed the increase of surface temperature. Moreover, correlations with a maximum error of 46∼126 s were obtained to predict the matching status between the thermal buffer and electronic devices, the effective protection time, etc., which was expected to guide the design of thermal buffers. In the future, some efforts should be made to alleviate the mismatching conditions, such as disturbing the boundary layers of natural convection by the elastic potential energy of spring or clockwork, etc.

engineering, mechanical,thermodynamics,mechanics