Abstract:A computer is mainly composed of chips on which a large number of semiconductor switches are fabricated. The requirement for increasing signal speed in the computer has focused the efforts of electronics industry on designing miniaturized electronic circuits and highly integrated circuit densities in chips. The integration technologies, which have advanced to the very large scale integration (VLSI) level, lead to an increased power dissipation rate at the chip, module and system levels. Sophisticated electronic cooling technology is needed to maintain relatively constant component temperature below the junction temperature, approximately 85°C for most mainframe memory and logic chips. Investigations have demonstrated that a single component operating 10°C beyond this temperature can reduce the reliability of some systems by as much as 50% (Nelson, 1978). Traditionally, convection heat transfer from electronic hardware to the surroundings has been achieved through the natural, forced, or mixed convection of air; however, even with advances in air-cooling techniques, the improvements will not suffice to sustain the expected higher heat fluxes. As an effective and increasingly-popular alternative to air cooling, directly immersing the component in inert, dielectric liquid can remove a large amount of heat dissipation, of which pool and forced boiling possess the attractive attribute of large heat transfer coefficient due to phase change compared with single-phase. An ideal boiling performance should provide adequate heat removal within acceptable chip temperatures. Direct liquid cooling, involving boiling heat transfer, by use of dielectric liquids has been considered as one of the promising cooling schemes. Primary issues related to liquid cooling of microelectronics components are mitigation of the incipience temperature overshoot, enhancement of established nucleate boiling and elevation of critical heat flux (CHF). Treated surface has been found to have great potential in enhancement of boiling heat transfer from electronic, significantly reducing the chip surface temperature and increasing CHF. Treated surfaces are used for nucleate boiling enhancement by applying some micro-structures on the chip surface to make the surface capable of trapping vapour and keeping the nucleation sites active or increasing effective heat transfer area. Since the 1970s, a number of active studies have dealt with the enhancement of boiling heat transfer from electronic components by use of surface microstructures that were fabricated directly on a silicon chip or on a simulated chip. These include a sand-blasted and KOH treated surface (Oktay 1982), a “dendritic heat sink” (brush-like structure) (Oktay and

Jet Impingement Boiling on Monocrystalline Silicon Surfaces with Open Microchannels

SUBCOOLED JET IMPINGEMENT BOILING ENHANCED BY POROUS SURFACE WITH MICROCOLUMN ARRAY

Enhanced Flow Boiling Heat Transfer with Jet Impingement on Micro-Pin-finned Surfaces

ENHANCED HEAT TRANSFER OF FLOW BOILING COMBINED WITH JET IMPINGEMENT

Jet array impingement boiling in compact space for high heat flux cooling

Silicon microchannels flow boiling enhanced via microporous decorated sidewalls

Experiment of Flow Boiling Heat Transfer on Micro-Pin-Finned Chips with Jet Impingement

Confined Submerged Jet Impingement Boiling of Subcooled Fc-72 over Micro-Pin-Finned Surfaces

Silicon-based Microjet Array Impingement Boiling Heat Transfer with SDS Surfactant Solutions

Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling

Flow Patterns of an Open Microchannel and Jet Impingement Hybrid Cooling Scheme

Effects of Heat Flux, Mass Flux and Two-Phase Inlet Quality on Flow Boiling in a Vertical Superhydrophilic Microchannel

Enhancement of flow-jet combined boiling heat transfer of FC-72 over micro-pin-finned surfaces

Jet Impingement Boiling Heat Transfer Performance of Refrigerant Hp-1 in Micro-Pin-Finned Surfaces for High-Power Chips

Enhanced Heat Transfer Characteristic of Micro-Pin-Finned Surfaces With Jet Impingement

Effects of Heat Flux, Mass Flux, Inlet Fluid Subcooling, and Channel Orientation on Subcooled Flow Boiling in a High-Aspect-Ratio Rectangular Microchannel

Enhanced Boiling Heat Transfer from Micro-Pin-Finned Silicon Chips

Flow-jet boiling heat transfer enhancement on micro-pin-finned chips

Flow Boiling in Microchannels Enhanced by Parallel Microgrooves Fabricated on the Bottom Surfaces

Flow Boiling in Vertical Narrow Microchannels of Different Surface Wettability Characteristics

Numerical simulation of boiling behavior in vertical microchannels