Abstract:For high-efficiently solving the power dissipation problem of electronic components with high heat flux, experimental study of the flow-jet combined boiling heat transfer on silicon chips was conducted. The micro-pin-fins with dimensions of 50×60 μm 2, 50×120 μm 2 (thickness × height) were fabricated on the chip surfaces by the dry etching technique. The experiments were made at three different crossflow velocities V c(0.5, 1.0, 1.5 m/s) and different jet velocities V j(0~2 m/s) with two liquid subcooling ΔT sub (25°C and 35°C). A smooth surface was also tested for comparison. The micro-pin-fins showed a considerable heat transfer enhancement due to increase in effective heat transfer surface area. The heat transfer enhancement at high heat flux region can be achieved by increasing liquid subcooling and velocities. For a fixed flow mass rate, adopting low V c large V j combination may obtain a high heat flux. The fin efficiency η f decreases as V c(V j) increases, but the increment decreases as V c increases. Besides, the fin efficiency η f also decreases as the heat flux q increases.

Flow-jet boiling heat transfer enhancement on micro-pin-finned chips