Abstract:Experiments of flow boiling heat transfer coefficient of FC-72 were carried out over simulated silicon chip of 10×10×0.5 mm3 for electronic cooling. Four kinds of micro-pin-fins with the dimensions of 30×60, 30×120, 50×60, 50×120 μm2 (thickness, t × height, h) respectively, were fabricated on the chip surfaces by the dry etching technique to enhance boiling heat transfer. A smooth chip was also tested for comparison. The experiments were conducted at three different fluid velocities (0.5, 1 and 2m/s) and three different liquid subcoolings (15, 25 and 35K). All micro-pin-finned surfaces show a considerable heat transfer enhancement compared to the smooth surface. Both the forced convection and nucleate boiling heat transfer contribute to the total heat transfer performance. The contribution of each factor to the total heat transfer has been clearly presented in the flow boiling heat transfer coefficient curves. In a lower heat flux region, the heat transfer coefficient increases greatly with increasing fluid velocity, but increases slightly with increasing heat flux, indicating that the single-phase forced convection dominates the heat transfer process. With further increasing heat flux to the onset of nucleate boiling, the heat transfer coefficient increases remarkably. For a given liquid subcooling, the curves of flow boiling heat transfer coefficient at fluid velocities of 0.5 and 1 m/s almost follow one line for each surface, showing insensitivity of nucleate boiling heat transfer to fluid velocity. However, at the largest fluid velocity of 2 m/s, the slope of the flow boiling heat transfer coefficient curves for micro-pin-finned surfaces becomes smaller, indicating that the forced convection also plays an important role besides the nucleate boiling heat transfer. The curves of the flow boiling heat transfer coefficient can be used to determine the boiling incipience at different fluid velocities, which provides a basis for the suitable fluid velocity selection in designing highly efficient cooling scheme for electronic devices.

Experiment of Flow Boiling Heat Transfer on Micro-Pin-Finned Chips with Jet Impingement

Enhanced Flow Boiling Heat Transfer with Jet Impingement on Micro-Pin-finned Surfaces

ENHANCED HEAT TRANSFER OF FLOW BOILING COMBINED WITH JET IMPINGEMENT

Enhancement of flow-jet combined boiling heat transfer of FC-72 over micro-pin-finned surfaces

Flow-jet boiling heat transfer enhancement on micro-pin-finned chips

Enhanced flow boiling heat transfer of FC-72 on micro-pin-finned surfaces

Experimental Study of Flow Boiling Heat Transfer Coefficient of Fc-72 over Micro-Pin-Finned Surfaces

Subcooled flow boiling heat transfer of FC-72 from silicon chips fabricated with micro-pin-fins

Confined Submerged Jet Impingement Boiling of Subcooled Fc-72 over Micro-Pin-Finned Surfaces

Enhanced Boiling Heat Transfer by Using Micro-Pin-Finned Surface in Three Different Test Systems

Enhanced Heat Transfer Characteristic of Micro-Pin-Finned Surfaces With Jet Impingement

Experimental study of boiling phenomena and heat transfer performances of FC-72 over micro-pin-finned silicon chips

Boiling Heat Transfer Enhancement by Using Micro-pin-finned Surface for Electronics Cooling

Effect of the Size of Micro-Pin-Fin on Boiling Heat Transfer from Silicon Chips Immersed in FC-72.

An Experimental Study of Microchannel and Micro-Pin-Fin Based On-Chip Cooling Systems with Silicon-to-Silicon Direct Bonding.

CHF Correlation of Boiling in FC-72 with Micro-Pin-fins for Electronics Cooling

EXPERIMENTAL STUDY ON POOL BOILING HEAT TRANSFER ENHANCEMENT WITH MICRO/NANOSTRUCTURED SURFACES

Flow Boiling Heat Transfer Characteristics on Micro-Pin-finned Surfaces in a Horizontal Narrow Microchannel

ENHANCED BOILING HEAT TRANSFER OF FC-72 FROM SURFACES WITH MICROSTRUCTURES

Jet array impingement boiling in compact space for high heat flux cooling

Experimental Study of Saturated Flow Boiling Heat Transfer in an Array of Micro-pin-fins