Abstract:Molecular dynamics simulations were performed to investigate the wetting behavior of Cu droplets on three distinct Fe surfaces: Fe(0 0 1), Fe(1 1 0), and Fe(1 1 1). The results reveal that Cu droplets exhibit a relatively stable layering order near the solid-liquid interface on all Fe surfaces while displaying different three-phase contact line structures. Influenced by the substrate surface structure and the extent of interfacial reactions, Cu droplets demonstrate superior wettability and the fastest spreading on Fe(1 1 1) surfaces, while exhibiting the poorest wettability and lowest spreading rate on Fe(0 0 1) surfaces. The spreading of Cu droplets on all Fe surfaces exhibits a similar driving mechanism, while is applicable to different spreading kinetic models emphasizing varying dissipation channels. The wetting process comprises a fast-spreading regime driven by inertia and a slow- spreading regime governed by surface tension, with dissolution reactions further enhancing the wetting kinetics. On Fe(0 0 1) surfaces, the spreading of precursor films can be well described by the molecular-kinetic model, while the primary dissipation mechanism for the main bodies of the droplets is the viscous dissipation within liquids, consistent with the hydrodynamic model. Conversely, on Fe(1 10) and (111) surfaces, the main limiting factor for spreading is the friction dissipation between the main bodies of the droplets and the precursor films, in line with the molecular-kinetic model. These findings offer new insights into the wetting phenomena of metal/ metal systems, particularly the liquid metal embrittlement associated with Cu(l)/Fe(s) l )/Fe( s ) wetting.

The comparative study of low-energy single Cu atom and Cu13 cluster depositing on the substrate of Fe ( 001 ) surface

Molecular Dynamics Simulation of Energetic Cu55 Clusters Deposition on a Fe (0 0 1) Surface

The Effect of Incident Energy and Cluster Size on the Deposition Cu Clusters on the Fe (001) Surface

Investigating the influence of substrate orientation and temperature on Cu cluster deposition

Kinetic Monte Carlo Simulation of Deposition of Energetic Copper Atoms on A Cu(001) Substrate

The influences of the local impact site and incident energy on the transport behaviors of single copper atom onto Cu (0 0 1) surface

The Influences Of The Local Impact Site And Incident Energy On The Transport Behaviors Of Single Copper Atom Onto Cu (001) Surface

Molecular dynamics investigation of deposition and annealing behaviors of Cu atoms onto Cu(0 0 1) substrate

Molecular dynamics investigation of deposition and annealing behaviors of Cu atoms onto Cu(001) substrate

Molecular dynamics simulations and analyzation of Cu deposited on stainless steel substrate surfaces

Ar-buffer-assisted Deposition of Cu13 on Cu(111) Surfaces

Wetting Behavior of Cu Droplets on Fe Surfaces: Insights from Molecular Dynamics Simulations

Deposition of an Energetic Al Cluster on Si(111) Substrate: A Molecular Dynamics Simulation

Structural stabilities and diffusion of small Fe clusters on Fe (1 1 0) surface: A molecular dynamics study

Structure Investigation of the Fe on Cu(110) Surface

Structural Stabilities And Diffusion Of Small Fe Clusters On Fe (110) Surface: A Molecular Dynamics Study

Kinetic Monte Carlo Simulation of Deposition of Co Thin Film on Cu(001)

Density functional theory study on the atomic structure and electronic states of Cu(l00) (√2 × 2 √2)R45°-O surface

Theoretical Study on the Aggregation of Copper Clusters on a Liquid Surface.

Study on synthesis and microstructure of Fe-Cu embedded clusters

Single Adatom Adsorption and Diffusion on Fe Surfaces