Abstract:Atomic-level manufacturing is fundamentally concerned with the precise removal, addition, and migration of material at the atomic and close-to-atomic scale (ACS). Tip-based electrochemical deposition, a quintessential ACS electrochemical additive manufacturing technique, offers promising prospects for achieving bottom-up fabrication of metallic micro/nano structures. However, the complex physicochemical reactions involved in electrodes lead to a limited understanding of the mechanisms underlying atomic electrodeposition and structural evolution. For the first time, this study proposes electric double-layer controlled electrochemical kinetics and investigates the effect of direct current (DC) and pulse current (PC) on nickel atomic electrodeposition using molecular dynamics (MD) simulations. The findings reveal that compared to DC electrodeposition, PC electrodeposition results in more orderly deposition morphology, improved surface smoothness, reduced dislocation density, and lower crystal distortion, with these effects being particularly pronounced under low pulse duty ratio conditions. In addition, the pulse frequency significantly influences the morphology and structure of the deposit. The high pulse frequency yields smoother surfaces with local protrusions, while the low frequency favors the formation of orderly and dense structures excepting slightly increased roughness. This study provides critical insights into understanding the microscopic mechanisms of atomic-scale electrodeposition processes and achieving atomically controlled tip-based electrochemical additive manufacturing of micro/nanodevices.

Current Transition of Nucleation and Growth under Diffusion-Controlled Electrocrystallization: A Brief Review

The Establishment of Current Transient of Nucleation and Growth under Diffusion-Controlled Electrocrystallisation: A Microreview

Potentiostatic Current Transient For Multiple Nucleation: A Limited-Diffusion Process Description

Electrochemical nucleation and growth mechanism of metals

Understanding the Nanoscale Phenomena of Nucleation and Crystal Growth in Electrodeposition

Heterogeneous nucleation - current transients under chemical reaction control

New in situ description of electrodepositing multiple nucleation processes under galvanostatic stimuli

Can a cylindrical geometry describe diffusion in a nanometric porous media?

Revisiting Diffusion-Limited C-rate Through Simulation: Formulation Revision and Mechanism Digging

Phase Field Modeling of Grain Boundary Migration and Preferential Grain Growth Driven by Electric Current Stressing

Phase Field Study of Concurrent Nucleation and Growth in A Diffusion-Controlled Solid-State Phase Transformation

Theory and Atomistic Simulation of Electrodeposition

Diffusion-convection Effects on Constrained Dendritic Growth in Dilute Alloys

Crossover between Re-Nucleation and Dendritic Growth in Electrodeposition without Supporting Electrolyte

Atomic-scale Understanding of Microstructural Evolution in Electrochemical Additive Manufacturing of Metallic Nickel

The Role Of Electric Current-Associated Free Energy And Forced Convection On Grain Refinement In Pure Aluminum Under Electropulsing

Can a cylindrical geometry describe reaction-driven diffusion in nanometric porous media?

Isotropic and Anisotropic Growth Models for the Sublimation Vapour Transport Process

Electrocrystallization Nucleation and Growth of NiFe Alloys on Brass Substrate

Particle-mediated Nucleation and Growth of Solution-Synthesized Metal Nanocrystals: A New Story Beyond the LaMer Curve

Over-limiting Current and Control of Dendritic Growth by Surface Conduction in Nanopores