Abstract:Ductile-regime machining has been used to generate damage-free surface of hard and brittle materials by setting the cutting depth to be smaller than the ductile-brittle transition depth (DBTD). However, the ductile-regime cutting of sapphire remains challenging owing to its extreme hardness, small DBTD, serious surface fractures, and severe tool wear. To solve this problem, ion implantation-assisted elliptical vibration cutting (Ii-EVC) has been proposed in this study to enhance the machinability of hard and brittle materials. Taking sapphire as an example, high-energy phosphorus ions were implanted into the workpiece to modify its surface. Nanoindentation tests revealed that the modified materials undergo plastic and elastic deformation more easily due to the decrease in hardness and modulus. Compared with nanocutting without implantation assistance, the DBTD of implanted sapphire has been increased by more than five times. The advantageous effects of Ii-EVC achieve great enhancement in machinability, including surface fractures suppression, tool-wear reduction, chips morphology transformation from discontinuous to continuous, and cutting force decrease. Furthermore, even near the cracks in the brittle region after Ii-EVC, the subsurface microstructure showed a more complete lattice arrangement and a strain distribution close to zero, indicating that crack propagation was effectively suppressed. Due to the promoted localized plastic deformation, the stress distribution in the implanted material is much smaller than that in pristine workpiece. Implantation-induced defects not only serve as a core for absorbing external energy from the high-frequency vibration and improving the in-grain deformation but also facilitate the formation of shear bands. The interface with high distortion between the modified layer and substrate can effectively dissipate strain energy and hinder crack propagation to the free surface. The turning experiments verified that Ii-EVC can achieve better surface quality, less tool wear and higher optical transmittance. Overall, Ii-EVC addresses the challenges of tool breakage and surface fracture caused by high-frequency collision between tool and workpiece in traditional EVC, overcomes the problem of limited modification depth in ion implantation, and increases the ductile-regime removal depth of extremely hard and brittle materials to several microns. Such findings demonstrate that Ii-EVC is a promising method for the ultra-precision manufacturing of advanced materials.

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Modification Mechanism of Collaborative Ions Implanted into 4H-Sic by Atomic Simulation and Experiment

Nano material removal mechanism of 4H-SiC in ion implantation-assisted machining

Anisotropic Deformation of 4H-Sic Wafers: Insights from Nanoindentation Tests

Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching

On the deformation mechanism of SiC under nano-scratching: An experimental investigation

Micromechanical properties characterization of 4H–SiC single crystal by indentation and scratch methods

Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal

Molecular dynamics simulation of the material removal in the scratching of 4H-SiC and 6H-SiC substrates

Lattice Defects and Exfoliation Efficiency of 6H-SiC via H2+ Implantation at Elevated Temperature

Characterization, Quantitative Evaluation, and Formation Mechanism of Surface Damage in Ultrasonic Vibration Assisted Scratching of Cf/SiC Composites

Femtosecond laser surface modification of 4H-SiC improves machinability

Investigation on the Material Removal Mechanism in Ion Implantation-Assisted Elliptical Vibration Cutting of Hard and Brittle Material

Material removal and damage formation mechanisms induced by periodic indentation during ultrasonic vibration-assisted scratching of SiC f /SiC composites

Unveiling Damage Mechanisms of SiC Fiber-reinforced Titanium Matrix Composites Through Ultrasonic Scratching

Molecular dynamics analysis of the influence of ion implantation parameters on ultra-precision machining of silicon carbide

Molecular Dynamics Simulation of Single-Crystal 4H-SiC Nano Scratching with Different Scratching Directions of the Tool

Surface Micromorphology and Nanostructures Evolution in Hybrid Laser Processes of Slicing and Polishing Single Crystal 4H-Sic

Investigation on the Machining Mechanism of Silicon Modified by Au Ion Irradiation in Elliptical Vibration Diamond Cutting