Influence of Post-Deposition Annealing on the Novel Alloyed SnSxO1-x Semiconductor in P-Type Thin-Film Transistors

Tao Zhang,Weihao Wang,Yunze Liu,Fengzhi Wang,Xinhua Pan,Bin Lu,Zhizhen Ye
DOI: https://doi.org/10.1016/j.mssp.2022.107037
IF: 4.1
2022-01-01
Materials Science in Semiconductor Processing
Abstract:SnO is an oxide semiconductor that has the potential to be used in the development of thin-film transistors (TFTs) with a p-type channel. SnO on the other hand is a metastable phase, and the oxidation of the SnO films makes high-performance TFTs with good mobility and high on/off current ratios challenging. In this study, based on the SnO–SnO2 phase transformation mechanism, a novel alloyed semiconductor SnSxO1-x was reported to prevent the conversion of SnO to SnO2. Pulsed laser deposition was used to grow SnO and SnSxO1-x thin films on Si/SiO2 substrates, which were then exposed to rapid annealing procedures. From Raman spectroscopic analysis, SnSxO1-x exhibited better antioxidant performance than pure SnO at the same post-deposition annealing process. The developed SnSxO1-x TFTs exhibited better stability and an improved on/off ratio than SnO TFTs after high-temperature annealing. Additionally, we fabricated bilayer SnSxO1-x/SnO thin-film transistors with typical p-channel conduction and a 10−11 A off-state current.
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