Preparation and characterization of SnO films via reactive sputtering for ambipolar thin-film transistor applications

Jingyong Huo,Xiaolin Wang,Xiaohan Wu,Wen-Jun Liu,Shi-Jin Ding
DOI: https://doi.org/10.1088/1361-6641/abbf0e
IF: 2.048
2020-01-01
Semiconductor Science and Technology
Abstract:SnO films are prepared by reactive magnetron sputtering under various O-2 partial pressures along with post-annealing in air. The results indicate that the O-2 partial pressure during reactive sputtering process not only influences the composition of the SnO film but also its texture. For the SnO film deposited under 10% O-2 partial pressure, its direct bandgap increases from 2.49 to 2.64 eV with elevating the post-annealing temperature from 250 degrees C to 400 degrees C. The above SnO-based channel thin-film transistors (TFTs) exhibit a typical ambipolar feature after post-annealing at >= 250 degrees C in air. For the TFTs annealed at 300 degrees C for 30 min, the extracted hole and electron field-effect mobility is 1.48 cm(2)V(-1)s(-1) and 0.21 cm(2)V(-1)s(-1), respectively. The performance of both p- and n-type TFTs could be further improved by optimizing fabrication process and post-annealing conditions because of a trade-off between hole and electron mobility.
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