Abstract:The authors report a new patterned electroless metallization process for creating micro- and nanoscale metallic structures on polymeric substrates, which are essential for emerging flexible and stretchable optical and electronic applications. This novel process features a selective adsorption of catalytic Pd nanoparticles (PdNPs) on a lithographically masked poly(dopamine) (PDA) interlayer in situ polymerized on the substrates. The moisture-resistant PDA layer has excellent stability under a harsh electroless plating bath, which enables electroless metallization on versatile substrate materials regardless of their hydrophobicity, and significantly strengthens the attachment of electroless plated metallic structures on the polymeric substrates. Prototype devices fabricated using this PDA-assisted electroless metallization patterning exhibit superior mechanical stability under high bending and stretching stress. The lithographic patterning of the PDA spatially confines the adsorption of PdNPs and reduces defects due to random adsorption of catalytic particles on the undesired area. The high resolution of the lithographic patterning enables the demonstration of a copper micrograting pattern with a linewidth down to 2 μm and a silver plasmonic nanodisk array with a 500 nm pitch. A copper mesh is also fabricated using our new patterned electroless metallization process and functions as flexible transparent electrodes with >80% visible transmittance and <1 Ω sq-1 sheet resistance. Moreover, flexible and stretchable dynamic electroluminescent displays and functional flexible printed circuits are demonstrated to show the promising capability of our fabrication process in versatile flexible and stretchable electronic devices.

Palladium-assisted Metal Patterning on Polyimide Surfaces

Metal Conductive Surface Patterning on Photoactive Polyimide

Adhesion-Enhanced Flexible Conductive Metal Patterns on Polyimide Substrate Through Direct Writing Catalysts with Novel Surface-Modification Electroless Deposition

Selective electroless deposition of copper on polyimide surface by microcontact printing

Fabrication of Conductive Copper Patterns Using Reactive Inkjet Printing Followed by Two-Step Electroless Plating

Fabrication of Patterned Polymer Resists for Ion Etching by Using Dewetting

Custom Writing Catalytic Tracks for Selective Pattern Metallization on Flexible Substrate

Direct writing patterns for electroless plated copper thin film on plastic substrates

Molecular Self-Assembly Combined with Electroless Copper Plating of Laser-Induced Patterning on Polyimide Film

A Simple Method to Fabricate A Conductive Polymer Micropattern on an Organic Polymer Substrate

Robust Conductive Micropatterns on PTFE Achieved Via Selective UV-Induced Graft Copolymerization for Flexible Electronic Applications.

Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film

Photosensitive Polyimide Enabled Simple, Reversible and Environmentally Friendly Selective Metallization on Diverse Substrates

Selective Electroless Metallization of Micro- and Nanopatterns via Poly(dopamine) Modification and Palladium Nanoparticle Catalysis for Flexible and Stretchable Electronic Applications.

Fabricating Metallic Circuit Patterns on Polymer Substrates Through Laser and Selective Metallization.

Fabrication of Copper Patterns on Polydimethylsiloxane Through Laser-Induced Selective Metallization

Electroactive Polymer Patterns with Metal Incorporation on A Polymeric Substrate

Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition

Laser Direct Activation of Polyimide for Selective Electroless Plating of Flexible Conductive Patterns

Implementation of high‐performance, freestanding flexible film masks through photosensitive polyimide for arbitrary surface micropatterns creation

A Simple Method For The Fabrication Of High-Resolution Conducting Polymer Patterns