MOCVD growth of thick V-pit-free InGaN films on semi-relaxed InGaN substrates
Ryan C White,Michel Khoury,Feng Wu,Stacia Keller,Mariia Rozhavskaia,David Sotta,Shuji Nakamura,Steven P DenBaars
DOI: https://doi.org/10.1088/1361-6641/abc51c
IF: 2.048
2020-11-17
Semiconductor Science and Technology
Abstract:Abstract The MOCVD growth of InGaN:Si base layers on a semi-relaxed InGaN substrate, where growth is generally difficult due to the presence of V-pits, is examined. These V-pits can propagate through the crystal, causing severe morphological degradation and significantly reducing material quality for device use. Such V-pits may also be a source of leakage current if they extend from the substrate through p-n junction. A wide range of InGaN growth conditions and their impact on V-pit formation and density are investigated. The use of thin GaN interlayers, carrier gas selection, and V/III ratio are found play a critical role in managing V-pit quantity and size. Finally, high temperature GaN interlayers are implemented, fully eliminating V-pit formation in 1200 nm thick InGaN base layers grown coherently on semi-relaxed InGaN substrates.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter