Strain Release in GaN Epitaxy on 4 degrees Off-Axis 4H-SiC

Sirui Feng,Zheyang Zheng,Yan Cheng,Yat Hon Ng,Wenjie Song,Tao Chen,Li Zhang,Kai Liu,Kai Cheng,Kevin J Chen
DOI: https://doi.org/10.1002/adma.202201169
IF: 29.4
2022-01-01
Advanced Materials
Abstract:A hybrid field-effect transistor (HyFET), superior for power electronic applications, can be created by harnessing the merits of two representative wide-bandgap semiconductors, gallium nitride (GaN) and silicon carbide (SiC). Yet, the incompactness in the epitaxy techniques hinders the development of the HyFET-GaN is usually grown on on-axis foreign substrates including SiC, whereas SiC homoepitaxy prefers off-axis substrates. This work presents a GaN-based heterostructure epitaxially grown on a conventional 4 degrees off-axis 4H-SiC substrate, which manifests its high quality and suitability for constructing GaN-based high-electron-mobility transistors, thereby suggesting a practical approach to realizing HyFETs. In the meanwhile, a distinct two-step biaxial strain-relaxation process is proposed and studied with comprehensive characterizations.
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