On the Temperature Distribution in Localized Heating for Low Temperature Sealing of Germanium-Borosilicate Glass

Zhang Qing-Chuan,Cas Key
2009-01-01
Abstract:In FPA(Focal Plane Array)vacuum packaging of the optical readout uncooled infrared imaging system,Germanium glass with antireflection coatings on both sides and Borosilicate glass are used as the windows for transmitting infrared light and visible light,respectively.Due to the temperature limitation of the antireflection coatings on Germanium glass(250℃) and FPA(100℃),the packaging process has to be conducted at low temperature,and thermal protection for FPA and antireflection coatings on Germanium glass must be designed correspondingly.This paper proposes a localized heating method for Germanium-Borosilicate Glass low temperature diffusion bonding.In the present method,Germanium window which has higher thermal conductivity is heated up from its outer surface(200℃),while the temperature at the outer surface of Borosilicate Glass with lower thermal conductivity is kept lower(60℃).Finite element simulation results indicate that temperature increase is relatively high in bonding region(200℃),satisfying the requirement of low temperature bonding,while the temperature of Germanium keeps below 250℃;moreover,the temperature increase in FPA region is relatively low(below 75℃).Meanwhile,simulation results are consistent with experimental measurement.Therefore,FPA and the antireflection coatings on Germanium can be protected effectively by proposed heating method.
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