Abstract:The increasing performance of microprocessors leads to higher bandwidth requirements for the data flow to and from the processor. Today, all signaling on a PCB is performed electrically, using copper lines that are integrated in the board. However, issues such as propagation loss and inter-channel crosstalk limit the scalability of electrical interconnects to ever higher bandwidth densities. Optical interconnects feature a higher bandwidth x length product, are more power-efficient and enable a higher bandwidth density than electrical interconnects do. This paper describes a kind of two-dimensional monolayer optical interconnects providing interconnections between chips on conventional PCB. We have designed a soft-lithography-based, versatile coupling structure with a 45 degrees total internal reflector (TIR), a beam duct, and a polymer waveguide in order to vertically couple light beams between transmitter (or receiver) and the waveguide layer. This proposed integrated architecture of a polymeric optical interconnection has been demonstrated to be advantageous in the aspects of misalignment tolerance, ease and low cost of fabrication, as well as relative simplicity in deployment. We also investigated the characteristics of in-plane connections including cross-over and branching nodes in the optical interconnects with experimental and theoretical analysis. The theoretical crosstak as calculated by a function of crossing angle, was determined for a set of interconnect pairs with varying cross-sections, and was compared with experimental measurements. Furthermore, a suitable branching angle was found for branching node and the effects of short-distance mode scrambling in highly multimode polymer waveguides were studied in detail in this paper too.

45° polymer-based total internal reflection coupling mirrors for fully embedded intraboard guided wave optical interconnects

45 Degrees Polymer-Based Total Internal Reflection Coupling Mirrors For Fully Embedded Intraboard Guided Wave Optical Interconnects

Fully Embedded Board-Level Optical Interconnects From Waveguide Fabrication to Device Integration

Analysis and Optimization of the Arrayed-Waveguide Grating Device with Total Internal Reflection Mirrors Based on Silicon-on-insulator Material

Mid-infrared Nonlinear Silicon Hybrid Waveguide with High Figure of Merit

Silicon-on-Insulator Waveguide Devices for Broadband Mid-Infrared Photonics

Soft-Lithography-Based Inter-Chip Optical Interconnects

Turning-Mirror-Integrated Arrayed-Waveguide Gratings on Silicon-on-Insulator

Compact Integrated Waveguide Turning Mirror in SOI

Compact Arrayed-Waveguide Grating on Silicon-On-Insulator with Integrated Waveguide Turning Mirrors

Triple-layered optical interconnecting integrated waveguide chip based on epoxy cross-linking fluorinated polymer photonic platform

Structurally-tolerant Vertical Directional Coupling Between Metal-Insulator-metal Plasmonic Waveguide and Silicon Dielectric Waveguide

High-efficiency Grating Coupler Based on Fast Directional Optimization and Robust Layout Strategy in 130 Nm CMOS Process.

Broadband Coupler Between Silicon Waveguide and Hybrid Plasmonic Waveguide

Mirror-Integrated Arrayed-Waveguide Grating On Silicon-On-Insulator

Birefringence compensated silicon nanowire arrayed waveguide grating for CWDM optical interconnects.

Menis Siob Design For Integrated Transceiver Application

Low-loss 3-dimensional waveguide crossing with a parabolic taper interlayer coupler based on a SiN-SiN-Si three-layer platform

High-Bandwidth and Large Coupling Tolerance Graded-Index Multimode Polymer Waveguides for On-board High-Speed Optical Interconnects

Long-wave infrared 1 × 2 MMI based on air-gap beneath silicon rib waveguides.