Abstract:The through silicon via (TSV) is one of the important enabling technologies of stacked 3-D ICs. However, the crosstalk is generated when signals are transmitted through the closely clustered TSVs due to the coupling effect. The crosstalk avoidance code (CAC) techniques have attracted great concerns in recent years, for the TSV-to-TSV crosstalk deteriorates the signal integrity. Nevertheless, the CAC techniques usually require specific shape of the TSV array, e.g., $3\times N$ array. This work proposes a crosstalk suppression scheme combining the CAC method and the static shielding technique, named Mosaic-3C1S. The proposed scheme is able to be applied to arbitrary rectangular TSV arrays. In the proposed scheme, the $2\times 2$ TSV subarray, which contains three signal TSVs and one shielding TSV, is used as the basic unit to tile the rectangular TSV array. The CAC method is applied to the signal TSVs in the $2\times 2$ subarrays, and the raw data are transmitted by the rest boundary TSVs, if any. In order to further reduce the bit overhead, a triangular numeral system (TNS)-based CAC, named TNS-CAC, is proposed and applied. The simulation results show that the proposed TNS-CAC has advantages on bit overhead and codec area. The proposed Mosaic-3C1S scheme with TNS-CAC is able to suppress the crosstalk between TSVs to 6C level. The bit overhead of the proposed scheme is between 25% and 45%, which is lower than that of the previous CAC methods for TSV arrays for the most cases.

Repair the Faulty TSVs with the Improved FNS-CAC Codec

A Global Self-Repair Method for TSV Arrays with Adaptive FNS-CAC Codec

An Enhancement of Crosstalk Avoidance Code Based on Fibonacci Numeral System for Through Silicon Vias

A new VLSI design for Viterbi decoder based on ASIP

Mosaic-3C1S: A Low Overhead Crosstalk Suppression Scheme for Rectangular TSV Array

An Improved Algorithm of CTI and Its Implementation on Hardware

Novel LC resonant clocking for 3D IC using TSV-inductor and capacitor

Scalable Video Coding Fault Tolerant Strategies Based on Feedback

A Crosstalk Avoidance Method Combining Crosstalk Avoidance Code with Shielding Wire Technique

Bus Partitioning Technique with Crosstalk Avoidance Code

A TSV Repair Method for Clustered Faults

An exhaustive search of the 6C level crosstalk avoidance codes for TSV array

Crosstalk Reduction in TSV Arrays with Direct Ohmic Contact Between Metal and Silicon-Substrate

Adaptive 3D-IC TSV Fault Tolerance Structure Generation

3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Improved Spatio-Snr FGS Video Coding Scheme Using Motion Compensation on Enhancement-Lay

Combining Circuit Level and System Level Techniques for Defect-Tolerant Nanoscale Architectures

A Symmetric Bridge-Based Pre-Bond TSV Faults Detection Method

New Crosstalk Avoidance Codes Based on a Novel Pattern Classification

A New Data Transmission Method with Low System Overhead Based on Multiple TSV Sub-Arrays