P-N Crossed Nanojunctions from Electroless-Etched Si Nanowires

Ming-Yen Lu,Sheng-Chieh Huang,Yen-Min Ruan,Yu-Ting Kuo,Hsiang-Chen Wang,Ming-Pei Lu
DOI: https://doi.org/10.1021/acs.jpcc.6b07729
2016-01-01
Abstract:Electroless etching was used to prepare p- and n-Si nanowire (NW) arrays from Si wafers, with the lengths of the Si NW arrays varied by controlling the etching time. The etching rate was similar to 150 nm/min up to 300 min but decreased notably, to 32 nm/min, thereafter. Transmission electron microscopy confirmed that the Si NWs were single-crystalline and aligned along the [001] direction. The dumbbell separation of 0.13 nm, observed using high-resolution high-angle annular-dark field scanning transmission electron microscopy, corresponded to Si atom arrangements projected along the [1-10] zone axis. A statistical study revealed that the average carrier concentrations of the p- and n-Si NW devices were 1.15 X 10(18) and 2.61 X 10(12) cm(-3), respectively, while the average carrier mobilities were 6.66 X 10(-3) and 5.41 x 10(-3) cm(2) V-1 s(-1), respectively. A subsequently prepared p-n Si NW crossed nanojunction exhibited rectifying behavior typical of a p-n junction. Thus the preparation of Si NW arrays from Si wafers through electroless etching appears to be an inexpensive, low-temperature technique for the mass production of various device architectures and applications.
What problem does this paper attempt to address?