Grain Size Engineered 0.95mgtio3–0.05catio3 Ceramics with Excellent Microwave Dielectric Properties and Prominent Mechanical Performance

Yan Yu,Yingjin Wang,Weijia Guo,Chaoqiong Zhu,An Ji,Hao Wu,Shujian Liang,Shan Xiong,Xiaohui Wang
DOI: https://doi.org/10.1111/jace.18045
IF: 4.186
2021-01-01
Journal of the American Ceramic Society
Abstract:Microwave communication systems are being developed with the goal to achieve miniaturization and high reliability. There are urgent requirements for microwave dielectric materials to exhibit low sintering temperatures, excellent microwave dielectric properties, and prominent mechanical performance. However, simultaneously achieving these requirements is a significant challenge. These concerns have been addressed in the uniform ultrafine-grained 0.95MgTiO(3)-0.05CaTiO(3) ceramics with an average grain size of similar to 0.5 mu m via a grain size engineering strategy. Interestingly, the sintering temperature in the unique two-step sintering method of 1250celcius/1 min and 1130celcius/10 h is much lower (200-300celcius) than that obtained in the conventional sintering method reported previously (1400-1450celcius). Excellent dielectric properties are achieved, with relative permittivity epsilon(r) = 20.11, quality factor Q x f = 68 613 GHz, and temperature coefficient of resonant frequency tau(f) = 1.81 ppm/celcius. The bending strength sigma f, Vickers hardness H-v, and elastic modulus E reach up to 212.4 MPa, 10.1 GPa, and 200.7 GPa, respectively. These values are significantly enhanced over those of samples obtained via the conventional sintering method with an average grain size of similar to 2.5 mu m. For the first time, uniform ultrafine-grained microwave dielectric materials with excellent microwave dielectric properties and prominent mechanical performance were synthesized. This work provides a guideline for developing other high-performance microwave dielectric materials and makes a significant contribution to the miniaturization and high reliability of microwave dielectric devices.
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