Gradient Nanostructured Surface of a Cu Plate Processed by Incremental Frictional Sliding

C. Hong,X. Huang,N. Hansen
DOI: https://doi.org/10.1088/1757-899x/89/1/012026
2015-01-01
IOP Conference Series Materials Science and Engineering
Abstract:The flat surface of a Cu plate was processed by incremental frictional sliding at liquid nitrogen temperature. The surface treatment results in a hardened gradient surface layer as thick as 1 mm in the Cu plate, which contains a nanostructured layer on the top with a boundary spacing of the order of 100 nm. The boundary spacing increases with increasing distance from the surface, and is accompanied with a decrease in hardness from 2179 +/- 31 MPa in the topmost surface layer to 568 +/- 10 MPa in the undeformed matrix.
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