Abstract:Abstract Near-infrared (NIR, 0.7–1.4 µm) imagers have wide applications in night surveillance, material sorting, machine vision and potentially automatic driving. However, limited by the high-temperature processing and requirement of single-crystalline substrate, so far flip-chip is the dominant way to connect infrared photodiodes and silicon-based readout integrated circuit (ROIC) to produce infrared imagers, suffering from complicated process and ultra-high cost and hence limiting their widespread applications in the market. Here we report the monolithic integration of colloidal quantum dots (CQD) photodiodes with complementary metal-oxide-semiconductor (CMOS) ROIC, operating as a low-cost and high-performance imager. The CQD photodetector is well designed with a CMOS-compatible structure, demonstrating a response spectral range of 400–1300 nm, a detectivity of 2.1×1012 Jones at room temperature, a -3dB bandwidth of 140 kHz and a linear dynamic range over 100 dB. The CQD imager can identify materials, inspect apple scar and veins with a large size of 640×512 pixels and a spatial resolution of 40 lp/mm at a modulation transfer function of 50%. Monolithic integration significantly reduces the cost without sacrificing performance, thus providing huge potential for the ubiquitous deployment of infrared imagers.

A Logarithmic Response Burst IRFPA ROIC with Pixel Level Integration of Memory

A Reconfigurable Convolution-in-Pixel CMOS Image Sensor Architecture

A LOW POWER HIGH RESOLUTION ROIC DESIGN WITH 14-BIT COLUMN-LEVEL ADC FOR 384 × 288 IRFPA

A High-resolution Colloidal Quantum Dot Imager by Monolithic Integration

A Low Power High Speed Readout Circuit for 320×320 IRFPA

14-Bit Column Readout Circuits with Single-to-differential PGA Using Intentional Offset and Two-Step Scaled-Reference SAR ADC for CMOS Image Sensors

A Low Power High Speed ROIC Design for 1024&#x00d7;1024 IRFPA with Novel Readout Stage

Novel Low Power QSBDI Structure for IR ROIC

Analysis and Design of a CMOS Ultra-High-Speed Burst Mode Imager with In-Situ Storage Topology Featuring In-Pixel CDS Amplification

A Low Power ROIC Design for 1024&#x00d7;1024 IRFPA

High Frame Rate High Precision ROIC with Pixel-level CCO-Based ADC for Infrared FPAs.

A low power ROIC design for 1024×1024 IRFPA

A Low Power Roic Design For 1024 X 1024 Irfpa

An Event-Driven High-Speed Imaging and Trace Detection ROIC for Cryogenic Infrared FPAs

The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for 10 mu m Pitch 640x512 Infrared Focal Plane Array

A prototype of ROIC for pyroelectric uncooled IRFPA with colume-level ADC

Low Power Design Orienting 384×288 Snapshot Infrared Readout Integrated Circuits

A 15-Bit Two-Step Pixel-Level ADC for 17Μm-Pitch Low-Power and High-Dynamic-range IRFPA.

Design of Readout Circuit for Microcantilever Infrared Focal Plane Array with Snapshot Integration

A Low Power High Output Frequency Two-stage Output Buffer for 2720×2704 Infrared Focal Plane Array