Abstract:Abstract Near-infrared (NIR, 0.7–1.4 µm) imagers have wide applications in night surveillance, material sorting, machine vision and potentially automatic driving. However, limited by the high-temperature processing and requirement of single-crystalline substrate, so far flip-chip is the dominant way to connect infrared photodiodes and silicon-based readout integrated circuit (ROIC) to produce infrared imagers, suffering from complicated process and ultra-high cost and hence limiting their widespread applications in the market. Here we report the monolithic integration of colloidal quantum dots (CQD) photodiodes with complementary metal-oxide-semiconductor (CMOS) ROIC, operating as a low-cost and high-performance imager. The CQD photodetector is well designed with a CMOS-compatible structure, demonstrating a response spectral range of 400–1300 nm, a detectivity of 2.1×1012 Jones at room temperature, a -3dB bandwidth of 140 kHz and a linear dynamic range over 100 dB. The CQD imager can identify materials, inspect apple scar and veins with a large size of 640×512 pixels and a spatial resolution of 40 lp/mm at a modulation transfer function of 50%. Monolithic integration significantly reduces the cost without sacrificing performance, thus providing huge potential for the ubiquitous deployment of infrared imagers.

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for 10 mu m Pitch 640x512 Infrared Focal Plane Array

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for $10\mu\mathrm{m}$ Pitch $640\times 512$ Infrared Focal Plane Array

Two‐stage ADC‐based ROICs for 25 Μm‐pitch Cryogenic Infrared Focal Plane Array

A Low Power High Output Frequency Two-stage Output Buffer for 2720×2704 Infrared Focal Plane Array

The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays

A Low Power High Speed Readout Circuit for 320×320 IRFPA

High Frame Rate High Linearity Low Power DROIC for 30Μm-Pitch Cryogenic Infrared FPAs.

A LOW POWER HIGH RESOLUTION ROIC DESIGN WITH 14-BIT COLUMN-LEVEL ADC FOR 384 × 288 IRFPA

A Low Power ROIC Design for 1024&#x00d7;1024 IRFPA

A low power ROIC design for 1024×1024 IRFPA

A Low Power High Speed ROIC Design for 1024&#x00d7;1024 IRFPA with Novel Readout Stage

A Low Power Roic Design For 1024 X 1024 Irfpa

Low Power Readout Circuit for 384×288 Uncooled IRFPA with Novel Readout Stage

A 16-Bit Two-Stage ADC for 320×256 Infrared Focal Plane Array

Low Power Design Orienting 384×288 Snapshot Infrared Readout Integrated Circuits

High Frame Rate High Precision ROIC with Pixel-level CCO-Based ADC for Infrared FPAs.

Low Power Readout Integrated Circuit with PFM-based ADCs Employing Residue Quantization for Uncooled Infrared Imagers

A High-resolution Colloidal Quantum Dot Imager by Monolithic Integration

Design of Readout Integrated Circuit for Uncooled Infrared Focal Plane Arrays Based on Microcantilever

A 16-Bit Pixel-level ADC Based on Ring Oscillator for 30μm Pitch 320 ×256 LWIR FPAs.

A readout structure with double column buses and shared source follower for IRFPAs