Abstract:Infrared detection signifies crucial and indispensable applications in numerous scenarios. Focal plane arrays (FPAs), the most vital devices in an infrared measurement system, are hindered by the incompatibility of the complementary metal oxide semiconductor (CMOS) integrated circuits and the photodetector fabrication process. In this report, a modified read-out circuit controlled by a microcontroller unit (MCU) is designed and fabricated to obtain signal outputs of FPA pixels using the multiplexing structure. The topological configuration of the connection between FPAs and the read-out circuit is explored, in addition, the principle of inter-pixel interference is elaborated. Feedback is delicately constructed in the modified read-out circuit to minimize the interference, which is overlooked in the previous work. To clarify the practical application of the modified read-out circuit, a PbSe FPA is prepared with microfabrication technologies and used to obtain 2-D mid-infrared (MIR) images of a heated target in real-time. The imaging results show apparent enhancement in contrast as we expect, which means that the inter-pixel interference is effectively reduced with our modified circuit. Thus, a good capability of anti-noise shows up in our photodetection measurement system, resulting in higher image quality. The modified read-out circuit can be further used in measurements comprised of various small-scale FPA chips with low fabrication costs.

A Low Power High Output Frequency Two-stage Output Buffer for 2720×2704 Infrared Focal Plane Array

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