Abstract:Infrared detection signifies crucial and indispensable applications in numerous scenarios. Focal plane arrays (FPAs), the most vital devices in an infrared measurement system, are hindered by the incompatibility of the complementary metal oxide semiconductor (CMOS) integrated circuits and the photodetector fabrication process. In this report, a modified read-out circuit controlled by a microcontroller unit (MCU) is designed and fabricated to obtain signal outputs of FPA pixels using the multiplexing structure. The topological configuration of the connection between FPAs and the read-out circuit is explored, in addition, the principle of inter-pixel interference is elaborated. Feedback is delicately constructed in the modified read-out circuit to minimize the interference, which is overlooked in the previous work. To clarify the practical application of the modified read-out circuit, a PbSe FPA is prepared with microfabrication technologies and used to obtain 2-D mid-infrared (MIR) images of a heated target in real-time. The imaging results show apparent enhancement in contrast as we expect, which means that the inter-pixel interference is effectively reduced with our modified circuit. Thus, a good capability of anti-noise shows up in our photodetection measurement system, resulting in higher image quality. The modified read-out circuit can be further used in measurements comprised of various small-scale FPA chips with low fabrication costs.

A Design of Readout Circuit for 384&#x00d7;288 Uncooled Microbolometer Infrared Focal Plane Array

Low Power Readout Circuit for 384×288 Uncooled IRFPA with Novel Readout Stage

The Design of a Low-Noise, High-Speed Readout-Integrated Circuit for Infrared Focal Plane Arrays

Design of ROIC in Uncooled Infrared Detector Based on MEMS

Design of Readout Integrated Circuit for Uncooled Infrared Focal Plane Arrays Based on Microcantilever

Low Power Design Orienting 384×288 Snapshot Infrared Readout Integrated Circuits

A LOW POWER HIGH RESOLUTION ROIC DESIGN WITH 14-BIT COLUMN-LEVEL ADC FOR 384 × 288 IRFPA

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A Low Power High Speed Readout Circuit for 320×320 IRFPA

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A low power ROIC design for 1024×1024 IRFPA

A Low Power ROIC Design for 1024&#x00d7;1024 IRFPA

A Low Power High Linearity Cryogenic Readout Integrated Circuit with Large Charge Handling Capacity for 10 mu m Pitch 640x512 Infrared Focal Plane Array

Two‐stage ADC‐based ROICs for 25 Μm‐pitch Cryogenic Infrared Focal Plane Array

A Low Power Roic Design For 1024 X 1024 Irfpa

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A 160×120 ROIC with Non-uniformity Calibration for Silicon Diode Uncooled IRFPA

Low Power Readout Integrated Circuit with PFM-based ADCs Employing Residue Quantization for Uncooled Infrared Imagers

A Low Power High Speed ROIC Design for 1024&#x00d7;1024 IRFPA with Novel Readout Stage

A 320 X 256 Readout Circuit with Wide Dynamic Range and High Injection Efficiency

A Readout Integrated Circuit Based on DBI-CTIA and Cyclic ADC for MEMS-array-based Focal Plane

A Design of Readout Circuit for 384&amp;#x00d7;288 Uncooled Microbolometer Infrared Focal Plane Array