A Multilayered Structure for Packageless Acoustic- Wave Devices with Ultra-Small Sizes

Junyao Shen,Sulei Fu,Rongxuan Su,Huiping Xu,Zengtian Lu,Fei Zeng,Cheng Song,Weibiao Wang,Feng Pan
DOI: https://doi.org/10.1109/jmems.2021.3074385
IF: 2.829
2021-01-01
Journal of Microelectromechanical Systems
Abstract:An increasing demand for surface acoustic wave filters with high performances contributes to the necessity of reducing sizes and costs. The present work proposes a multilayered structure of high-velocity layer/SiO2/interdigital transducers (IDTs)/piezoelectric-single-crystal substrate to further validate the strengths of packageless devices. Resonators based on the SiNx/SiO2/IDTs(Cu)/15 degrees Y-X LiNbO3 structure are simulated and analyzed. One-port resonators are designed, fabricated and tested on the basis of the simulation, and results validates the feasibility of no encapsulation. Finally, by using this multilayered structure, a packageless filter with a center frequency of 2.14 GHz and an ultra-small size of 0.695 x 0.490 x 0.122 mm(3) is successfully designed and realized, maintaining well-balanced performances. This work has demonstrated the strengths of packageless devices which can be obtained by utilizing the proposed multilayered structure, and may promote the development of device miniaturization.
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