Saw-type sintering metal base diamond saw blade for cutting QFN (Quad Flat Non-leaded) package substrate

Junma Nan,Kewei Xu,Jingchao Zhang
2010-01-01
Abstract:The invention discloses a saw-type sintering metal base diamond saw blade for cutting a QFN (Quad Flat Non-leaded) package substrate, which comprises diamond abrasive particles and metal matrix. The metal matrix comprises metal powder and inorganic filler, wherein the metal powder consists of Cu powder, or CuSn20 prealloying powder, Sn powder and Co powder, and the inorganic filler consists of SiC and Al2O3; two series of metal matrix which take Cu and Co as bases are formed according to high-content elements. The qualified metal base diamond saw blade is prepared by the following steps of: firstly, preparing the components of the matrix of the metal base diamond saw blade; and then evenly mixing all the metal powders and the inorganic filler, and then mixing with the diamond abrasive particles; carrying out cold-pressed performing, and then carrying hot-pressed sintering to prepare a metal base diamond saw blade blank; and finally carrying out precision finishing, such as internal and external circle cutting, thickness reducing and the like. The saw-type sintering metal base diamond saw blade has the advantages of high strength and good abrasion resistance, and has the characteristics of high processing efficiency and long service life on the premise of satisfying the quality requirement of on-line chip cutting.
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