Thin metal-based diamond cutting slice for cutting semiconductor chip BGA encapsulation body in saw mode and manufacturing method thereof

Junma Nan,Kewei Xu
2009-01-01
Abstract:The invention discloses a thin metal base diamond composite material cutting disk in order to meet the requirement of cutting a BGA encapsulation body of an organic laminated board of a semiconductor chip in a sawing manner. Detailed description is made in the invention with respect of composition design, preparation technology, forming technology, precision work and the like of the cutting disk. According to the technical proposal provided by the invention and the manufacture process designed by the invention, a diamond is selected for cutting. Centering on a holding mechanism that combines the construction and particle firmness thereof, selections of different composition formulas of tire carcasses are respectively given. The cutting disk is prepared under the conditions of hot pressed sintering or braze welding technology, which not only improves the combination form of metal tire carcasses and diamond particles so as to enhance the holding force and the continuous self-sharpening capacity, but also establishes matching wear relation between the radial direction and both sides so as to form a approximately flat cutting appearance at a blade end, thereby ensuring that the cutting length is greatly improved on the basis of guaranteeing the high-precision cutting quality of the chips, and being beneficial to the significant reduction of production cost.
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