Communication-Fast Bottom-Up Filling of High Aspect Ratio Micro Vias Using a Single CTAB Additive

Houya Wu,Zhiyi Li,Yan Wang,Wenhui Zhu
DOI: https://doi.org/10.1149/1945-7111/abbce5
IF: 3.9
2020-01-01
Journal of The Electrochemical Society
Abstract:In this study, by adding a single additive of Cetyltrimethyl Ammonium Bromide (CTAB) to the electrolyte, the bottom-up filling of micro via (phi 20 mu m x 200 mu m) was obtained with a fast filling rate. Accordingly, it was found that CTAB has a better diffusion performance and electrodeposition inhibition effect compared to a typical suppressor and leveler. Moreover, the filling results of the micro vias indicated that CTAB can be transported to the deep region of the micro via, successfully limiting the growth of Cu on the sidewall in these regions.
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