Study of the Corrosion Resistance of Eletroless Amorphous Ni-P and Ni-Sn-P Coatings in Weak Acidic Medium

Hai-hui ZHOU,Cheng-ping ZHANG,Chen-xu FANG,Bing FENG,Song XU,Zuo-wei LIAO,Ya-fei KUANG

DOI: https://doi.org/10.3969/j.issn.1674-2974.2015.12.010

2015-01-01

Abstract:Amorphous Ni-P and Ni-Sn-P coatings were prepared on pure copper substrates by electro-less plating.The structure,surface morphology and composition of the as-plated coatings were character-ized by X-ray diffraction (XRD),scanning electron microscopy (SEM)and energy-dispersive analysis (EDS).The corrosion resistance behaviors of the as-plated Ni-P and Ni-Sn-P coatings were investigated by Tafel polarization,electrochemical impedance spectroscopy (EIS),open circuit potential and accelerating corrosion indoors in w NaCl =3.5% solution at pH 5.5 and in soil with a water content of w S=20% at pH 5. 5.The results indicate that electroless amorphous Ni-P and Ni-Sn-p plating of the corrosion current densi-ty is 4.5% and 1.2% of the bare copper and the two coatings offer better corrosion resistance than copper in weak acidic corrosive medium,while Ni-Sn-P coating exhibits the best corrosion resistance.Besides,the two coatings have a negative shift of self-corrosion potential when compared with Cu substrate,showing a good application prospect as anodic protective coatings for Cu ground wires in acidic or weak acidic soil me-dium.