Current Status of Design and Manufacture on W/Cu Interface of the Fist Wall Material

LUO Lai-ma,TAN Xiao-yue,LUO Guang-nan,ZAN Xiang,ZHU Xiao-yong,WU Yu-cheng
DOI: https://doi.org/10.3969/j.issn.0254-6086.2014.04.010
2014-01-01
Abstract:This paper reviews the current method of solving the W/Cu interface connection and relieving the thermal stress by added adaptation layer. After analyzing the different adaptation layer, the best W/Cu adaptation layer is selected, and then the W/Cu layer structure optimization analysis is conducted. The results show that using W/Cu functionally graded materials as the combination of the adaptation layer has enough strength, and good thermal conductivity are more effective to alleviate thermal stress. In addition, this paper expounds the current method which utilizes the successfully prepared W/Cu functionally gradient materials as W/Cu adaptation layer used in the first wall materials. Finally, this paper has made the summary and prospect about that the functionally gradient materials of W/Cu used as the adaptation layer to solve the first wall material W/Cu interface connection.
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