Fabrication and Testing of Capacitive Pressure Microsensor

WANG Shao-qing,XU Ken,FENG Yong-jian
DOI: https://doi.org/10.3969/j.issn.1002-1841.2005.03.002
2005-01-01
Abstract:Introduced the capacitive pressure microsensor produced by Si-Si bonding technology in terms of the practicality of MEMS products.The producing technology and major diagrams were given in detail.The components of the testing equipment and working process of the testing circuit were introduced and analyzed in detail.At last,some testing experiments were done for the produced capaticive pressure microsensors.The results show that the microsensor has excellent linearity,high sensitivity and relatively good stability.
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