Abstract:EFAB ("Electrochemical FABrication") is a new micromachining process promising to rapidly and automatically batch fabricate high-aspect-ratio microstructures with arbitrary 3-D geometry using inexpensive equipment. Conventional microfabrication processes have so far produced fairly simple geometries (e.g., 1-5 structural layers), yet many MEMS could benefit if more sophisticated shapes could be manufactured. By using "Instant Masking" (IM)-a novel in-situ micropatterning method-to simplify, accelerate, and automate through-mask electroplating, EFAB can produce extremely complex shapes by depositing hundreds-thousands of layers at high speed. While other processes often do not allow integration with ICs, EFAB operates at less than 60 degrees C, making IC compatibility a possibility. Alternative processes require costly facilities and equipment; EFAB separates photolithography from device fabrication, requiring a cleanroom only for mask-making, then depositing all layers in a low-cost, self-contained machine. All Instant Masks required can be prepared simultaneously, without repeating the lithography on each layer. Selective electrodeposition requires simply mating the mask with the substrate and applying current; in this way we have patterned well-defined features as small as 20 x 20 mu m. The procedures in EFAB are selective electrodeposition, blanket electrodeposition, and planarization. To date we have built metal structures with up to 12 layers consisting of independently-moving components.

Research on thick photoresist mask electroplating process in micro-fabrication

Thick Photoresists for Electroforming Metallic Microcomponents

Stress-Etching Using Laser Electrochemical Micromachining with Masks

A New Electroplating Mask for Deep Wet Etching on Glass

Fabrication of Patterned Polymer Resists for Ion Etching by Using Dewetting

Electroplating Copper Mask for Glass Deep Wet Etching in MEMS Relay

Laminated Photoresist Sacrificial Layer Technology for MEMS

Fabrication Of Ultrathick Micromolds Using Jsr Thb-430n Negative Uv Photoresist

A Simple Photomask with Photoresist Mask Layer for Ultraviolet-Photolithography and Its Application for Selectively Photochemical Surface Modification of Polymers

Study on non-uniformity of Through-Mask electroplated Ni thin-film

Fabrication of Surface Microstructures by Mask Electrolyte Jet Machining

Integration of Electrospray and Digital Light Processing for Freeform Patterning of Porous Microstructures

Dual layer photoresist and back sputtering applied in lift-off technique

Study of Nanoimprint Technology Without Residual Layer Based on Photolithography Mask

Electro-aggradation Zn As Sacrificial Layer Technology in Micro Fabrication

Finite Element Analysis of A Mask-Less Electrochemical Texturing (mect) Method on Metallic Surface

28nm Metal Hard Mask etch process development

Imprint Template Fabrication Based on Glass Wet Etching Using A Soft Etching Mask

Finite element simulation and experimental study on the through-mask electrochemical micromachining (EMM) process

Efab: Low-Cost Automated Electrochemical Batch Fabrication Of Arbitrary 3-D Microstructures