Abstract:Through-mask electrodeposition (TM-ECD) is a widely-used technique for manufacturing mesoscale and microscale precision metal features and components in a mass-production manner. However, in most cases, the traditional TM-ECD processes are very hard to fabricate high-accuracy multiscale (macroscale, mesoscale, microscale) features simultaneously due to the inherent nonuniform distribution of the applied energy fields including electric field, mass transportation field, and temperature field during electrodeposition. Furthermore, nanocrystalline microstructures have not been realized by TM-ECD without additional nonmetallic additives or mechanical stirring. Here, a ultrafine anode scanning through-mask electrodeposition (UASTM-ECD) process operated at DC mode is developed to further trigger the formation of nanocrystalline without additives, in which a ultrafine wire-shaped inert anode embedded in a stirring paddle reciprocates over the top surfaces of the through-masks with a spacing of less than 100 μm. Experimental investigations into this unique TM-ECD were systemically carried out by examining the geometrical profile, surface morphologies, forming accuracy, grain size, and mechanical properties of the fabricated nanocrystalline structures and components. Our findings showed that the UASTM-ECD can facilitate to achieve a significantly improved thickness distribution uniformity and considerably fine nanocrystalline ultrapure microscale and mesoscale complex cross-sectional arrays components over the traditional TM-ECD processes even though the multiscale features and components are simultaneously deposited on the same substrate. These result from the unique deposition manner of the UASTM-ECD in which the metal materials are intermittently filled into the patterned photoresist cavity molds very locally and at the extremely high current densities. This versatile approach eliminates the possible contamination by additives and integration difficulty of mechanical stirring, which can be used to fabricate the multiscale ultrahigh strength and high accuracy ultrapure nanostructured-material features.

Efab: Low-Cost Automated Electrochemical Batch Fabrication Of Arbitrary 3-D Microstructures

Efab: Rapid, Low-Cost Desktop Micromachining Of High Aspect Ratio True 3-D Mems

EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process

Efab: Batch Production of Functional, Fully-Dense Metal Parts with Micron-Scale Features

Electrostatic layer-by-layer nano-assembly: films, cantilevers, micropatterns, and nanocapsules

Electro-mechanically Controlled Assembly of Reconfigurable 3D Mesostructures and Electronic Devices Based on Dielectric Elastomer Platforms.

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Fabrication of Large Scale Bi-layer Microstructure through Electrochemical Nanoimprinting

Electrostatic Force-Assisted Nanoimprint Lithography (EFAN).

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Additive manufacturing multiscale ultrahigh strength and high accuracy nanocrystalline nickel stuructures and components using ultrafine anode scanning through-mask electrodeposition

Electrochemical additive manufacturing of micro/nano functional metals

Electrochemical Replication and Transfer for Low-Cost, Sub-100 Nm Patterning of Materials on Flexible Substrates.

Towards Green 3D-Microfabrication of Bio-MEMS Devices Using ADEX Dry Film Photoresists

A Novel Fabrication Methodology for Micromachined Sensor-Arrays with Multi-Thickness Configuration