An Electrochemical Study of Micro-electroforming Ni for LIGA Technique

LI Yong-hai,DING Gui-fu,ZHANG Yong-hua,CAO Ying,ZHAO Xiao-lin

DOI: https://doi.org/10.3969/j.issn.1000-4742.2005.02.003

2005-01-01

Abstract:Micro-electroforming is characterized by both resist-patterned electr oplating and resist-structural electrodepositing. The kinetics of the electrode reaction is preliminarily studied by linear potential sweep technique and electrochemical impedance while electrodepositing Ni for high aspect ratio structures. The results show that ma ss transfer and diffusion are easier to be the control factors of electrode reaction in electro forming due the high aspect ratio mask, which will result in electroforming defects. The advanc ed electroforming techniques, which reformed mass transfer ability, can improve th e performances of electroforming microstructures.