Detection and control of the pre-oxidation layer on copper film during direct bonded copper processing

Caixia WANG,Renli FU,Haiyang ZHU,Shixun LUAN,He LIU

DOI: https://doi.org/10.14106/j.cnki.1001-2028.2018.02.013

2018-01-01

Abstract:The copper layer of ceramic substrate coated copper was pre-oxidized by means of controlling oxidation method. The effects of per-oxidation temperature and oxygen partial pressure on the phase and thickness of copper oxide were studied. The phase of copper oxide film was measured by Raman spectroscopy. The absorbance of copper oxide film was tested by ultraviolet-visible spectrophotometer. The relationship between the absorbance and thickness of copper oxide was determined. The results indicate that Cu2O is formed on the surface of the copper foil when the oxidation temperature is between 400 ℃ and 800 ℃, and the oxygen partial pressure is controlled at 100×10–6-700×10–6. Under the condition of excessively high pre-oxidation temperature and oxygen partial pressure, copper foil surface produces CuO phase. The oxide film thickens, loose surface and local oxide film off are not conducive to the preparation of DBC substrate. The uniform and dense Cu2O film can be obtained on the surface of the copper foil when the oxygen partial pressure is 500×10–6, the pre-oxidation time is 1h and the temperature is 600 ℃.The oxide film and the matrix Cu are tightly bonded to improve the bonding performance of the DBC substrate.