Abstract:The most important factor that causes delamination between copper alloy lead frame and epoxy mold compound is copper oxide. To identify the factors that influence the formation of oxide film on copper substrate, oxidation mechanism of several lead-frame copper alloys was investigated. The oxide film structure of copper alloy was found to be CuO/Cu2O/Cu by AES analysis. Various copper alloys had great difference in CuO/Cu2O ratio. Oxidation rate of copper alloy was further studied by measuring the oxide thickness as a function of time at 320°C. The results showed that C5191 and C7025 had lower oxidation rate than EFTEC64T and C194, which promoted the growth of CuO. The calculation from AES depth profile of copper atom confirmed that grain boundary diffusion coefficients of C5191 and C7025 were nearly two magnitudes smaller than those of EFTEC64T and C194. At a low temperature (usually below half of melting point), the growth of oxide film is mainly dominated by the grain boundary diffusion. It was found by SPM analysis that copper alloys with smaller grain size had more paths for copper atom to diffuse from substrate to the interface of oxide and air, thus leading to higher oxidation rate. The segregation effect of solute elements of copper alloys at the oxide/substrate interface also played an important role in the growth of oxide.

Oxidation of Lead Frame Copper Alloys with Different Compositions and Its Effect on Oxide Film Adhesion

The Status and Development of Oxidation of Copper Alloy for Lead Frame

Oxidation failure mechanism of copper alloy lead frame for IC package

Oxidation Failure Of Lead Frame Copper Alloys With-Surface Electroplated Pure Cu

Effect of Ag on Oxidation of Cu-base Leadframe

Effects of Trace Element Ag on Oxidation Failure of Copper Lead Frame

Effects of Fe-Al-Mo Penetrant on Resistance to Oxidation for Infiltrated Layer of Red Copper

The Influence of Pre-Heat Treatment on Peeling Resistance of Oxide Film of Copper Alloy Lead Frames

Microstructure-dependent oxidation-assisted dealloying of Cu0.7Al0.3 thin films

The Investigation Of Some Properties Of Copper Alloys For Lead Frame

Effects of Small Additions of Copper and Copper + Nickel on the Oxidation Behavior of Iron

Effects Of Small Additions Of Copper And Copper Plus Nickel On The Oxidation Behavior Of Iron

Effect of Cu Lead-Frame Oxidation Time on Cu/EMC Interfaces in Power Devices

Effect of Cold-Spray Parameters on Surface Roughness, Thickness and Adhesion of Copper-Based Composite Coating on Aluminum Alloy 6061 T6 Substrate

The Effect of Lead Frame Material on Interface Microstructure Between Copper Alloy and SnPb Solder

The composition-dependent oxidation film formation in Mg-Li-Al alloys

Influence of Different Copper Feedstock Powders on the Microstructure and Corrosion Resistance of Coatings Prepared by Cold Gas Spray

Effect of Double Oxide Film Defects on Mechanical Properties of As-Cast C95800 Alloy

Effect of Dilute Tellurium and Selenium Additions on the High-Temperature Oxidation Resistance of Copper Alloys

Study on the Mechanism of Melting Oxidation of Zn-9Al-2.5Mg-Be Alloy

Corrosion Resistance of 3,4‐dihydroxyphenylalanine/octadecylamine Complex Coatings on Copper Substrate